Inventor

CHU CHIA-HUA

TW190 patents

⚠️ This page may combine multiple inventors who share the name “CHU CHIA-HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHU CHIA-HUA

TAIWAN SEMICONDUCTOR MFG CO LTD

MEMS and CMOS integration with low-temperature bonding

Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer

MEMS structure and manufacturing method thereof

Multi-pressure MEMS package

Semiconductor device and package and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

MEMS integrated pressure sensor devices and methods of forming same

MEMS integrated pressure sensor and microphone devices and methods of forming same

CMOS compatible BioFET

CMOS compatible BioFET

Integrated semiconductor device and wafer level method of fabricating the same

MEMS device with a capping substrate

Micro-electro mechanical system (MEMS) device having a blocking layer formed between closed chamber and a dielectric layer of a CMOS substrate

MEMS pressure sensor and microphone devices having through-vias and methods of forming same

Gas sensor, integrated circuit device using the same, and manufacturing method thereof

Method for the integration of a microelectromechanical systems (MEMS) microphone device with a complementary metal-oxide-semiconductor (CMOS) device

Wafer level method of sealing different pressure levels for MEMS sensors

Integrated microphone device and manufacturing method thereof

MEMS packaging techniques

Sensor in an internet-of-things

Manufacturing method of sensor in an internet-of-things

Method of making ohmic contact on low doped bulk silicon for optical alignment

MEMS microphone having diaphragm

Method and structure for CMOS-MEMS thin film encapsulation

Manufacturing method of semiconductor structure including heater

Structure and formation method of semiconductor device structure

Integration scheme for microelectromechanical systems (MEMS) devices and complementary metal-oxide-semiconductor (CMOS) devices

TAIWAN SEMICONDUCTOR MFG

MEMS integrated pressure sensor and microphone devices and methods of forming same

MEMS structure with adaptable inter-substrate bond

MEMS devices and methods for forming same

MEMS integrated pressure sensor devices and methods of forming same

MEMS device and method of forming the same

MEMS integrated pressure sensor devices having isotropic cavities and methods of forming same

MEMS device and method of forming the same

MEMS integrated pressure sensor devices having isotropic cavities and methods of forming same

MEMS integrated pressure sensor devices and methods of forming same

Semiconductor arrangement with stress release configuration

Integrated semiconductor device and wafer level method of fabricating the same

Method for forming biochips and biochips with non-organic landings for improved thermal budget

MEMS structure with adaptable inter-substrate bond

CHU CHIA-HUA

MEMS device having chip scale packaging

MEMS devices and methods for forming the same

LIN CHUNG-HSIEN

MEMS device with release aperture

Multiple bonding in wafer level packaging

TSAI YI HENG

MEMS structure and method of forming same

LIANG KAI-CHIH

MEMS devices and methods of forming same

KALNITSKY ALEXANDER

CMOS compatible BioFET

CHEN TUNG-TSUN

Temperature stabilitized MEMS

CHU RICHARD

Hermetic wafer level packaging

CHENG CHUN-WEN

Wafer level packaging