Inventor

HUANG HUAI

US77 patents

⚠️ This page may combine multiple inventors who share the name “HUANG HUAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG HUAI

IBM

Semiconductor device with selective dielectric deposition

Fully aligned via with integrated air gaps

Skip-vias bypassing a metallization level at minimum pitch

Barrier-less prefilled via formation

Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device

Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device

Skip-vias bypassing a metallization level at minimum pitch

Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device

Reflow interconnect using Ru

Forming deep airgaps without flop over

Heterogeneous metallization using solid diffusion removal of metal interconnects

Forming chamferless vias using thermally decomposable porefiller

Backside floating metal for increased capacitance

Magnetic tunnel junction device with minimum stray field

Method and structure for forming fully-aligned via

Silicide formation for source/drain contact in a vertical transport field-effect transistor

Semiconductor device with selective insulator for improved capacitance

Measuring defectivity by equipping model-less scatterometry with cognitive machine learning

Method and structure to construct cylindrical interconnects to reduce resistance

Selective ILD deposition for fully aligned via with airgap

High-density MIM capacitors

Structure and fabrication method for enhanced mechanical strength crack stop

Machine learning enhanced optical-based screening for in-line wafer testing

Contact structure for power delivery on semiconductor device

Skip-level TSV with hybrid dielectric scheme for backside power delivery

Hybrid buried power rail structure with dual front side and backside processing

Airgap spacer for power via

Dual structured buried rail

Backside power plane

Dielectric caps for power and signal line routing

Top via patterning using metal as hard mask and via conductor

Barrier-less prefilled via formation

Silicide formation for source/drain contact in a vertical transport field-effect transistor

Skip via connection between metallization levels

SZ DJI TECHNOLOGY CO LTD

Lidar sensor system with small form factor

LIDAR sensor system with small form factor

LIDAR sensor system with small form factor

Hollow motor apparatuses and associated systems and methods

Lidar

Laser-based measurement device and movable platform

Laser-based measurement device and movable platform

TESSERA INC

Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device

Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device

Selective ILD deposition for fully aligned via with airgap

ADEIA SEMICONDUCTOR SOLUTIONS LLC

Selective ILD deposition for fully aligned via with airgap

Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device

TESSERA LLC

Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device

Selective ILD deposition for fully aligned via with airgap

BEIJING TIDE PHARMACEUTICAL CO LTD

Receptor inhibitor, pharmaceutical composition comprising same, and use thereof

Receptor inhibitor, pharmaceutical composition comprising same, and use thereof