P

Inventor

MIYAZAKI MASASHI

JP62 patents
⚠️ This page may combine multiple inventors who share the name “MIYAZAKI MASASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIYO YUDEN KK

20 patents
US7348662B2Mar 25, 2008

Composite multi-layer substrate and module using the substrate

TAIYO YUDEN KK19 citations92
US7738256B2Jun 15, 2010

Multilayer substrate including components therein

TAIYO YUDEN KK15 citations84
US7379306B2May 27, 2008

Multilayer substrate including components therein

TAIYO YUDEN KK11 citations84
US8988885B2Mar 24, 2015

Electronic circuit module and method for producing the same

TAIYO YUDEN KK8 citations81
US10785876B2Sep 22, 2020

Intermediate printed board for making multiple printed circuit boards and method of manufacturing the same

TAIYO YUDEN KK2 citations73
US10674601B2Jun 2, 2020

Printed wiring board and camera module

TAIYO YUDEN KK3 citations73
US7745926B2Jun 29, 2010

Composite multi-layer substrate and module using the substrate

TAIYO YUDEN KK7 citations73
US10607940B2Mar 31, 2020

Semiconductor module

TAIYO YUDEN KK2 citations72
US9301407B2Mar 29, 2016

Method of manufacturing substrate having cavity

TAIYO YUDEN KK6 citations72
US9253386B2Feb 2, 2016

Camera module

TAIYO YUDEN KK4 citations72
US10043726B2Aug 7, 2018

Embedded component substrate with a metal core layer having an open cavity and pad electrodes at the bottom of the cavity

TAIYO YUDEN KK2 citations68
US10957652B2Mar 23, 2021

Circuit board

TAIYO YUDEN KK0 citations62
US10939562B2Mar 2, 2021

Multilayer board and manufacturing method of the same

TAIYO YUDEN KK0 citations62
US10204733B2Feb 12, 2019

Module substrate

TAIYO YUDEN KK1 citations62
USRE45146ESep 23, 2014

Composite multi-layer substrate and module using the substrate

TAIYO YUDEN KK3 citations62
US7278205B2Oct 9, 2007

Multilayer printed wiring board and production method therefor

TAIYO YUDEN KK6 citations58
US11069589B2Jul 20, 2021

Circuit board and circuit module

TAIYO YUDEN KK0 citations52
US10050014B2Aug 14, 2018

Circuit substrate and method of manufacturing same

TAIYO YUDEN KK0 citations52
US10021791B2Jul 10, 2018

Multilayer wiring substrate

TAIYO YUDEN KK1 citations52
US8811021B2Aug 19, 2014

Electronic circuit module

TAIYO YUDEN KK0 citations52

HITACHI LTD

6 patents

MIYAZAKI MASASHI

5 patents

OMRON TATEISI ELECTRONICS CO

5 patents

ADVANTEST CORP

4 patents

AISIN AW CO

3 patents

BROTHER IND LTD

2 patents

INOUE YUSUKE

1 patent

IBM

1 patent

SEIKO ELECTRONIC COMPONENTS

1 patent

SONY SEMICONDUCTOR SOLUTIONS CORP

1 patent

YOKOTA HIDEKI

1 patent

Showing the top 50 of 62 patents by PatentIndex Score.