Composite multi-layer substrate and module using the substrate

Abstract

A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.

What is claimed is: 
     
       1. A composite multi-layer substrate comprising:
 a flat plate-like core member formed of a material having excellent electric conductivity, heat conductivity and high rigidity properties; 
 a front side resin layer covering a front surface of said core member; 
 a rear side resin layer covering a rear surface of said core member; 
 a bottomless hole formed in said core member penetrating a front and rear of said core member; 
 an electronic component mounted in said bottomless hole, the thickness of the electronic component after mounting in said bottomless hole at least does not cross the upper surface height position of said core member; 
 a small hole formed in either one or both of said front side resin layer and said rear side resin layer located directly above or directly below the electronic component and extends in a vertical direction of the front surface and the rear surface of said core member; and 
 an electrode formed on an interior portion of said small hole; 
 wherein an electrical connection to the electronic component is provided via the electrode. 
 
     
     
       2. A composite multi-layer substrate comprising:
 a flat plate-like core member formed of a material having excellent electric conductivity, heat conductivity and high rigidity properties; 
 a front side resin layer covering a front surface of said core member; 
 a rear side resin layer covering a rear surface of said core member; 
 a bottomless hole formed in said core member and said rear side resin layer penetrating a front and rear of said core member and a front and rear of said rear side resin layer; 
 an electronic component mounted in said bottomless hole, the thickness of the electronic component height size being lower than a depth size of said core member; and 
 a height size adjustment member having excellent heat conductivity interposed among said electronic component and said core member and said rear side resin layer, wherein a rear side surface of the height size adjustment member and the rear side resin layer form a flat surface; 
 wherein said height size adjustment member is interposed between the bottom of said electronic component when said electronic component height size is lower than the depth size of said core member mounted in said bottomless hole, wherein said height size adjustment member is adapted to adjusting a height of said electronic component. 
 
     
     
       3. A composite multi-layer substrate comprising:
 a flat plate-like core member formed of a material having excellent electric conductivity, heat conductivity and high rigidity properties; 
 a front side resin layer covering a front surface of said core member; 
 a rear side resin layer covering a rear surface of said core member; 
 a bottomless hole formed in said core member and said rear side resin layer penetrating a front and rear of said core member and a front and rear of said rear side resin layer; 
 an electronic component mounted in said bottomless hole, the thickness of the electronic component height size being lower than a depth of said core member; and 
 a height size adjustment member interposed among said electronic component and said core member and said rear side resin layer; 
 wherein said core member is a subtractively patterned core member. 
 
     
     
       4. The composite multi-layer substrate according to  claim 1 , further comprising:
 a column segment which divides said core member and penetrates said front and rear surfaces in a thickness direction of said core member; and 
 said column segment is adapted to providing an electrical signal transmission path or a power supply voltage transmission path to the front and rear surfaces of said substrate. 
 
     
     
       5. A composite multi-layer substrate comprising:
 a flat plate-like core member formed of a material having excellent electric conductivity, heat conductivity and high rigidity properties; 
 a front side resin layer covering a front surface of said core member; 
 a rear side resin layer covering a rear surface of said core member; 
 a flat bottomed hole formed in an opening of either one of said front surface of said core member or said rear surface of said core member; and 
 an electronic component mounted in said flat bottomed hole, the thickness of the electronic component after mounting in said flat bottomed hole at least does not cross the upper surface height position of said core member; 
 a small hole formed in either one or both of said front side resin layer and said rear side resin layer located directly above or directly below the electronic component and extends in a vertical direction of the front surface and the rear surface of said core member; and 
 an electrode formed on an interior portion of said small hole; 
 wherein an electrical connection to the electronic component is provided via the electrode. 
 
     
     
       6. The composite multi-layer substrate according to  claim 1 , wherein said structures are thicknesses. 
     
     
       7. The composite multi-layer substrate according to  claim 5 , wherein said structures are thicknesses. 
     
     
       8. A module, comprising:
 the composite multi-layer substrate set forth in any one of claims 1, 2, 3, and 5; and   one or more of electronic components mounted above or below said composite multi-layer substrate.   
     
     
       9. The module according to claim 8, wherein the module includes an upper rank layer, an intermediate layer below the upper rank layer, and a bottom rank layer below the intermediate rank layer,
 wherein the composite multi-layer substrate corresponds to said intermediate layer, and   wherein the upper rank layer has electrode patterns therein, and said one or more of electronic components are mounted on said electrode patterns.   
     
     
       10. A composite multi-layer substrate comprising:
 a flat plate-like core member formed of a metallic material, the core member having a mounting hole therein;   an upper resin layer covering an upper surface of said core member;   a lower resin layer covering a lower surface of said core member; and   an electronic component mounted in said mounting hole in the core member, a top surface of the electronic component being substantially flush with the upper surface of said core member or being positioned below a level of said upper surface,   wherein at least one of the upper resin layer and the lower resin layer has, at a position directly above or below the electronic component, a through-hole having an electrode formed therein to provide for an electric connection to the electronic component.   
     
     
       11. A composite multi-layer substrate comprising:
 a flat plate-like core member formed of a metallic material the core member having a mounting hole therein;   an upper resin layer covering an upper surface of said core member;   a lower resin layer covering a lower surface of said core member; and   an electronic component mounted in said mounting hole in the core member, the thickness of the electronic component being smaller than the thickness of said core member,   wherein at least one of the upper resin layer and the lower resin layer has, at a position directly above or below the electronic component, a through-hole having an electrode formed therein to provide for an electric connection to the electronic component.   
     
     
       12. A composite multi-layer substrate comprising:
 a flat plate-like core member formed of a metallic material the core member having a mounting hole therein;   an upper resin layer covering an upper surface of said core member;   a lower resin layer covering a lower surface of said core member; and   an electronic component mounted in said mounting hole, a bottom surface of the electronic component being not lower than a level of the lower surface of said core member,   wherein at least one of the upper resin layer and the lower resin layer has, at a position directly above or below the electronic component, a through-hole having an electrode formed therein to provide for an electric connection to the electronic component.   
     
     
       13. The composite multi-layer substrate according to any one of claims 10-12, further comprising:
 a height size adjustment member between said core member and said lower resin layer,   wherein the height size adjustment member is distinct from said core member and does not provide an electronic connection to the electronic component mounted in said mounting hole,   wherein the thickness of the electronic component is smaller than the thickness of said core member.   
     
     
       14. The composite multi-layer substrate according to any one of claims 10-12, wherein said metallic material is Invar. 
     
     
       15. The composite multi-layer substrate according to any one of claims 10-12, wherein said metallic material is copper. 
     
     
       16. The composite multi-layer substrate according to any one of claims 10-12, wherein said metallic material has a rigidity that is greater than the rigidity of a resin material. 
     
     
       17. The composite multi-layer substrate according to any one of claims 10-12, wherein the mounting hole is a bottomless hole penetrating said core member. 
     
     
       18. The composite multi-layer substrate according to any one of claims 10-12, wherein the mounting hole is a bottomed hole. 
     
     
       19. A module, comprising:
 an upper rank layer having electrode patterns therein;   an intermediate layer below the upper rank layer;   a bottom rank layer below the intermediate rank layer;   one or more of electronic components mounted on said electrode patterns in the upper rank layer;   wherein said intermediate layer is a composite multi-layer substrate comprising:
 a flat slate-like core member having a mounting hole therein; 
 an upper resin layer covering an upper surface of said core member; 
 a lower resin layer covering a lower surface of said core member; and 
 an electronic component mounted in said mounting hole, the electronic component having an electrode pad, 
 wherein at least one of the upper resin layer and the lower resin layer has, at a position directly above the electronic component, a through-hole having an electrode formed therein, and the electrode in the through-hole is in direct contact with the electrode pad of the electronic component mounted in said mounting hole. 
   
     
     
       20. The module according to claim 19, wherein a top surface of the electronic component is substantially flush with the upper surface of said core member or is positioned below a level of said upper surface. 
     
     
       21. The module according to claim 19, wherein the thickness of the electronic component is smaller than the thickness of said core member. 
     
     
       22. The module according to claim 19, wherein a bottom surface of the electronic component is not lower than a level of the lower surface of said core member. 
     
     
       23. A module, comprising:
 the composite multi-layer substrate set forth in an one of claims 10, 11, and 12; and   one or more of electronic components mounted above or below said composite multi-layer substrate.   
     
     
       24. The module according to claim 23, wherein the module further comprises an upper rank layer, an intermediate layer below the upper rank layer, and a bottom rank layer below the intermediate rank layer,
 wherein the composite multi-layer substrate corresponds to said intermediate layer, and   wherein the upper rank layer has electrode patterns therein, and said one or more of electronic components are mounted on said electrode patterns.   
     
     
       25. The module according to claim 19, wherein the electrode in the through-hole is directly below at least one of said electrode patterns in the upper rank layer and is electrically connected thereto. 
     
     
       26. The module according to claim 23, wherein the electrode in the through-hole is directly below at least one of said electrode patterns in the upper rank layer and is electrically connected thereto.