Inventor · disambiguated record
Masashi Miyazaki
Also filed as: MIYAZAKI MASASHI
60 granted patents·8 pending applications·365 citations·filing 1987–2023
98Inventor score
Top patents by PatentIndex Score
68 records- 0196US9998052B2Rotary electric machine control deviceAISIN AW CO·Filed 2015·Granted Jun 12, 2018·10 cites·12 claims
- 0295US8314343B2Multi-layer board incorporating electronic component and method for producing the sameINOUE YUSUKE·Filed 2008·Granted Nov 20, 2012·51 cites·8 claims
- 0392US11056984B2Inverter control deviceAISIN AW CO·Filed 2018·Granted Jul 6, 2021·4 cites·20 claims
- 0492US8320447B2Encoding apparatus and encoding method, and decoding apparatus and decoding methodMIYAZAKI MASASHI·Filed 2010·Granted Nov 27, 2012·16 cites·20 claims
- 0591US7275197B2Testing apparatusADVANTEST CORP·Filed 2005·Granted Sep 25, 2007·25 cites·3 claims
- 0689US11436770B2Motion analysis device, motion analysis method and recording mediumOMRON TATEISI ELECTRONICS CO·Filed 2020·Granted Sep 6, 2022·2 cites·8 claims
- 0789US11380137B2Motion analysis device, motion analysis method and recording mediumOMRON TATEISI ELECTRONICS CO·Filed 2020·Granted Jul 5, 2022·2 cites·12 claims
- 0888US7738256B2Multilayer substrate including components thereinTAIYO YUDEN KK·Filed 2008·Granted Jun 15, 2010·15 cites·5 claims
- 0985US8988885B2Electronic circuit module and method for producing the sameTAIYO YUDEN KK·Filed 2013·Granted Mar 24, 2015·8 cites·4 claims
- 1085US8791783B2Electronic component to be embedded in substrate and component-embedded substrateMIYAZAKI MASASHI·Filed 2011·Granted Jul 29, 2014·10 cites·9 claims
- 1184US7379306B2Multilayer substrate including components thereinTAIYO YUDEN KK·Filed 2005·Granted May 27, 2008·11 cites·16 claims
- 1283US9301407B2Method of manufacturing substrate having cavityTAIYO YUDEN KK·Filed 2014·Granted Mar 29, 2016·6 cites·12 claims
- 1382US10674601B2Printed wiring board and camera moduleTAIYO YUDEN KK·Filed 2018·Granted Jun 2, 2020·3 cites·7 claims
- 1481US8119451B2Method of manufacturing semiconductor package and method of manufacturing substrate for the semiconductor packageMIYAZAKI MASASHI·Filed 2010·Granted Feb 21, 2012·5 cites·8 claims
- 1580US7745926B2Composite multi-layer substrate and module using the substrateTAIYO YUDEN KK·Filed 2007·Granted Jun 29, 2010·7 cites·3 claims
- 1679US10607940B2Semiconductor moduleTAIYO YUDEN KK·Filed 2018·Granted Mar 31, 2020·2 cites·13 claims
- 1778USRE45146EComposite multi-layer substrate and module using the substrateTAIYO YUDEN KK·Filed 2013·Granted Sep 23, 2014·3 cites·26 claims
- 1878US7348662B2Composite multi-layer substrate and module using the substrateTAIYO YUDEN KK·Filed 2003·Granted Mar 25, 2008·19 cites·9 claims
- 1977US11443558B2Hand-eye, body part motion recognition and chronologically aligned display of recognized body partsOMRON TATEISI ELECTRONICS CO·Filed 2020·Granted Sep 13, 2022·1 cites·18 claims
- 2077US10840845B2Vehicle drive control deviceAISIN AW CO·Filed 2018·Granted Nov 17, 2020·3 cites·15 claims
- 2177US10785876B2Intermediate printed board for making multiple printed circuit boards and method of manufacturing the sameTAIYO YUDEN KK·Filed 2018·Granted Sep 22, 2020·2 cites·15 claims
- 2275US9253386B2Camera moduleTAIYO YUDEN KK·Filed 2014·Granted Feb 2, 2016·4 cites·6 claims
- 2373US9317199B2Setting a display position of a pointerIBM·Filed 2014·Granted Apr 19, 2016·3 cites·17 claims
- 2473US8774205B2Network device and its control method and computer program productMIYAZAKI MASASHI·Filed 2012·Granted Jul 8, 2014·3 cites·6 claims
- 2572US6190834B1Photosensitive resin composition, and multilayer printed circuit board using the sameHITACHI LTD·Filed 1998·Granted Feb 20, 2001·44 cites·19 claims
- 2669US11983448B2Non-transitory computer-readable storage medium and control device for conditional notificationBROTHER IND LTD·Filed 2022·Granted May 14, 2024·0 cites·10 claims
- 2767US10043726B2Embedded component substrate with a metal core layer having an open cavity and pad electrodes at the bottom of the cavityTAIYO YUDEN KK·Filed 2016·Granted Aug 7, 2018·2 cites·8 claims
- 2864US8189674B2Decoding method, program for decoding method, recording medium with recorded program for decoding method, and decoding deviceSHIGEMOTO DAIJOU·Filed 2007·Granted May 29, 2012·5 cites·8 claims
- 2963US10204733B2Module substrateTAIYO YUDEN KK·Filed 2016·Granted Feb 12, 2019·1 cites·5 claims
- 3063US7096139B2Testing apparatusADVANTEST CORP·Filed 2004·Granted Aug 22, 2006·11 cites·9 claims
- 3162US11367995B2Electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Jun 21, 2022·0 cites·26 claims
- 3262US10957652B2Circuit boardTAIYO YUDEN KK·Filed 2020·Granted Mar 23, 2021·0 cites·3 claims
- 3362US10021791B2Multilayer wiring substrateTAIYO YUDEN KK·Filed 2015·Granted Jul 10, 2018·1 cites·7 claims
- 3462US9484372B2Substrate for embedding imaging device and method for manufacturing same, and imaging apparatusTAIYO YUDEN KK·Filed 2015·Granted Nov 1, 2016·1 cites·8 claims
- 3561US8959400B2System, program, and method for collecting errors which occur while a user uses a computerMIYAZAKI MASASHI·Filed 2011·Granted Feb 17, 2015·1 cites·27 claims
- 3661US7237167B2Testing apparatusADVANTEST CORP·Filed 2004·Granted Jun 26, 2007·10 cites·5 claims
- 3760US5914216AMultilayer circuit board and photosensitive resin composition used thereforHITACHI LTD·Filed 1997·Granted Jun 22, 1999·18 cites·16 claims
- 3859US5294291AProcess for the formation of a conductive circuit patternHITACHI LTD·Filed 1992·Granted Mar 15, 1994·24 cites·36 claims
- 3957US11700450B2Motion analysis device, motion analysis method for improving motions of operatorOMRON TATEISI ELECTRONICS CO·Filed 2020·Granted Jul 11, 2023·0 cites·12 claims
- 4057US10939562B2Multilayer board and manufacturing method of the sameTAIYO YUDEN KK·Filed 2020·Granted Mar 2, 2021·0 cites·11 claims
- 4156US2009307323A1Apparatus and method for supporting setting of destination of emailIBM·Filed 2009·Application pending·0 cites
- 4255US8060326B2Measuring apparatus, measuring method and test apparatusMIYAZAKI MASASHI·Filed 2009·Granted Nov 15, 2011·2 cites·10 claims
- 4354US8963016B2Printed wiring board and method for manufacturing sameYOKOTA HIDEKI·Filed 2009·Granted Feb 24, 2015·2 cites·14 claims
- 4453US8811021B2Electronic circuit moduleTAIYO YUDEN KK·Filed 2013·Granted Aug 19, 2014·0 cites·7 claims
- 4552US7278205B2Multilayer printed wiring board and production method thereforTAIYO YUDEN KK·Filed 2003·Granted Oct 9, 2007·6 cites·3 claims
- 4652US2025239104A1Work recognition device, work recognition method, and recording medium storing work recognition programOMRON TATEISI ELECTRONICS CO·Filed 2022·Application pending·0 cites
- 4751US2022115834A1Electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Application pending·0 cites
- 4851US2025182008A1Work recognition device, work recognition method, and recording medium storing work recognition programOMRON TATEISI ELECTRONICS CO·Filed 2023·Application pending·0 cites
- 4950US7928560B2Composite multi-layer substrate and module using the substrateTAIYO YUDEN KK·Filed 2010·Granted Apr 19, 2011·0 cites·7 claims
- 5047US2015068795A1Substrate with built-in electronic component and core base-material for substrate with built-in electronic componentTAIYO YUDEN KK·Filed 2013·Application pending·0 cites
Showing the top 50 of 68 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →