Inventor · disambiguated record
Tatsuro Sawatari
Also filed as: SAWATARI TATSURO
22 granted patents·3 pending applications·141 citations·filing 2003–2019
94Inventor score
Top patents by PatentIndex Score
25 records- 0195US8314343B2Multi-layer board incorporating electronic component and method for producing the sameINOUE YUSUKE·Filed 2008·Granted Nov 20, 2012·51 cites·8 claims
- 0288US7738256B2Multilayer substrate including components thereinTAIYO YUDEN KK·Filed 2008·Granted Jun 15, 2010·15 cites·5 claims
- 0385US8988885B2Electronic circuit module and method for producing the sameTAIYO YUDEN KK·Filed 2013·Granted Mar 24, 2015·8 cites·4 claims
- 0484US7379306B2Multilayer substrate including components thereinTAIYO YUDEN KK·Filed 2005·Granted May 27, 2008·11 cites·16 claims
- 0583US9301407B2Method of manufacturing substrate having cavityTAIYO YUDEN KK·Filed 2014·Granted Mar 29, 2016·6 cites·12 claims
- 0682US10681820B2Circuit board and manufacturing method thereforTAIYO YUDEN KK·Filed 2019·Granted Jun 9, 2020·4 cites·4 claims
- 0782US9101050B2Circuit module having electrical shieldTAIYO YUDEN KK·Filed 2013·Granted Aug 4, 2015·6 cites·1 claims
- 0880US7745926B2Composite multi-layer substrate and module using the substrateTAIYO YUDEN KK·Filed 2007·Granted Jun 29, 2010·7 cites·3 claims
- 0978USRE45146EComposite multi-layer substrate and module using the substrateTAIYO YUDEN KK·Filed 2013·Granted Sep 23, 2014·3 cites·26 claims
- 1078US7348662B2Composite multi-layer substrate and module using the substrateTAIYO YUDEN KK·Filed 2003·Granted Mar 25, 2008·19 cites·9 claims
- 1175US9253386B2Camera moduleTAIYO YUDEN KK·Filed 2014·Granted Feb 2, 2016·4 cites·6 claims
- 1261US9055671B2Substrate with built-in electronic componentTAIYO YUDEN KK·Filed 2014·Granted Jun 9, 2015·0 cites·11 claims
- 1360US9007782B1Substrate with built-in electronic componentTAIYO YUDEN KK·Filed 2014·Granted Apr 14, 2015·0 cites·20 claims
- 1460US8964407B2Substrate with built-in electronic componentTAIYO YUDEN KK·Filed 2013·Granted Feb 24, 2015·0 cites·6 claims
- 1557US9101075B2Substrate with built-in componentTAIYO YUDEN KK·Filed 2013·Granted Aug 4, 2015·1 cites·2 claims
- 1657US8923009B2Substrate with built-in electronic componentTAIYO YUDEN KK·Filed 2013·Granted Dec 30, 2014·0 cites·10 claims
- 1753US8811021B2Electronic circuit moduleTAIYO YUDEN KK·Filed 2013·Granted Aug 19, 2014·0 cites·7 claims
- 1852US7278205B2Multilayer printed wiring board and production method thereforTAIYO YUDEN KK·Filed 2003·Granted Oct 9, 2007·6 cites·3 claims
- 1950US7928560B2Composite multi-layer substrate and module using the substrateTAIYO YUDEN KK·Filed 2010·Granted Apr 19, 2011·0 cites·7 claims
- 2047US2015068795A1Substrate with built-in electronic component and core base-material for substrate with built-in electronic componentTAIYO YUDEN KK·Filed 2013·Application pending·0 cites
- 2143US9818780B2Camera moduleTAIYO YUDEN KK·Filed 2014·Granted Nov 14, 2017·0 cites·14 claims
- 2243US9363897B2Substrate with built-in electronic componentTAIYO YUDEN KK·Filed 2013·Granted Jun 7, 2016·0 cites·8 claims
- 2341US2007029109A1Multilayer printed wiring board and production method thereforMIYAZAKI MASASHI·Filed 2006·Application pending·0 cites
- 2440US2014049928A1Substrate with built-in electronic componentSAWATARI TATSURO·Filed 2012·Application pending·0 cites
- 2536US9078370B2Substrate with built-in electronic componentSUGIYAMA YUICHI·Filed 2012·Granted Jul 7, 2015·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →