Inventor

LIN YU-SHENG

TW135 patents

⚠️ This page may combine multiple inventors who share the name “LIN YU-SHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN YU-SHENG

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor device package including conformal metal cap contacting each semiconductor die

Semiconductor package structure and method for forming the same

Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereof

Semiconductor package and method of forming the same

Frames stacked on substrate encircling devices and manufacturing method thereof

Chip package structure and method for forming the same

Structure and formation method of package with underfill

Semiconductor package

Semiconductor package

Method for forming package structure

Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the same

Package assembly including liquid alloy thermal interface material (TIM) and seal ring around the liquid alloy TIM and methods of forming the same

Semiconductor package with substrate recess and methods for forming the same

Package structure with buffer layer embedded in lid layer

Chip package structure with ring dam

Semiconductor die package with ring structure

Semiconductor package

Semiconductor package including stress-reduction structures and methods of forming the same

Package assembly including liquid alloy thermal interface material (TIM) and seal ring around the liquid alloy TIM and methods of forming the same

Package structure and method of fabricating the same

Semiconductor package and method of forming the same

Package structure and method of forming the same

Package structures and method for forming the same

Encircling a semiconductor device with stacked frames on a substrate

Semiconductor package

Package structure with warpage-control element

Semiconductor die package with thermal management features

Structure and formation method of chip package with reinforcing structures

Method for forming semiconductor die package with ring structure comprising recessed parts

Package structure with buffer layer embedded in lid layer

Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the same

Semiconductor package

Package structure and method of fabricating the same

Package structure and method of forming the same

Semiconductor die package with ring structure for controlling warpage of a package substrate

Structure and formation method of package with warpage-control element

Semiconductor die package with thermal management features and method for forming the same

PAI LUNG MACHINERY MILL CO LTD

Yarn measuring device for flat bed knitting machines

Needle bed structure for flat knitting machines

Circular knitting machine for prompting knitting machine status instantaneously based on cloth surface status of fabric

(unassigned)

Freely connectable chest unit

Chest

D LINK CORP

System and method for file access and sharing

NAT TAIWAN UNIVERSITY AN UNIVERSITY OF TAIWAN R O C

Porcine pancreatic amylase gene promoter and transgenic pigs expressing heterologous digestive enzymes

E INK HOLDINGS INC

Electrophoretic display apparatus

LIN YU-SHENG

Yarn feeder for flat knitting machines

SUSSEX ENTPR CO LTD

Transmission device for chainless bicycle

ACCTON TECHNOLOGY CORP

Quasi-pushout method associated with upper-layer packet discarding control for packet communication systems with shared buffer memory

IND TECH RES INST

Differential capacitor device and method for calibrating differential capacitor

SCINOPHARM TAIWAN LTD

Forms of apremilast and the process of making the same