P

Inventor

LIN SHIH-CHIN

TW42 patents
⚠️ This page may combine multiple inventors who share the name “LIN SHIH-CHIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MEDIATEK INC

20 patents
US9761534B2Sep 12, 2017

Semiconductor package, semiconductor device using the same and manufacturing method thereof

MEDIATEK INC11 citations84
US9597752B2Mar 21, 2017

Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereof

MEDIATEK INC7 citations84
US9000581B2Apr 7, 2015

Semiconductor package

MEDIATEK INC7 citations83
US10354974B2Jul 16, 2019

Structure and formation method of chip package structure

MEDIATEK INC2 citations73
US9908203B2Mar 6, 2018

Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereof

MEDIATEK INC4 citations73
US9881902B2Jan 30, 2018

Semiconductor package, semiconductor device using the same and manufacturing method thereof

MEDIATEK INC2 citations73
US10186488B2Jan 22, 2019

Manufacturing method of semiconductor package and manufacturing method of semiconductor device

MEDIATEK INC1 citations62
US12021068B2Jun 25, 2024

Semiconductor device with dummy thermal features on interposer

MEDIATEK INC0 citations59
US11983848B2May 14, 2024

AI frame engine for mobile edge

MEDIATEK INC0 citations59
US11869831B2Jan 9, 2024

Semiconductor package with improved board level reliability

MEDIATEK INC0 citations58
US11580621B2Feb 14, 2023

AI frame engine for mobile edge

MEDIATEK INC0 citations58
US12118653B2Oct 15, 2024

Depth analyzer and shading rate controller

MEDIATEK INC0 citations53
US11854784B2Dec 26, 2023

Chip scale package structure and method of forming the same

MEDIATEK INC0 citations52
US10312222B2Jun 4, 2019

Semiconductor package and semiconductor device using the same

MEDIATEK INC0 citations52
US9437577B2Sep 6, 2016

Package on package structure with pillar bump pins and related method thereof

MEDIATEK INC1 citations52
US9184107B2Nov 10, 2015

Semiconductor package

MEDIATEK INC0 citations51
US10242927B2Mar 26, 2019

Semiconductor package, semiconductor device using the same and manufacturing method thereof

MEDIATEK INC0 citations49
US10121222B2Nov 6, 2018

Bandwidth efficient method for generating an alpha hint buffer

MEDIATEK INC1 citations47
US9361697B1Jun 7, 2016

Graphic processing circuit with binning rendering and pre-depth processing method thereof

MEDIATEK INC0 citations41
US9252068B2Feb 2, 2016

Semiconductor package

MEDIATEK INC0 citations41

UNITED MICROELECTRONICS CORP

9 patents

PIXART IMAGING INC

4 patents

IND TECH RES INST

2 patents

SILICON INTEGRATED SYS CORP

1 patent

WANG CHING-CHIUN

1 patent

TPO DISPLAYS CORP

1 patent

FARADAY TECH CORP

1 patent

FENG CHIEN-TE

1 patent

MEDIATEK SINGAPORE PTE LTD

1 patent

LIN SHIH-CHIN

1 patent