Inventor

CHANG SHOU-ZEN

TW87 patents

⚠️ This page may combine multiple inventors who share the name “CHANG SHOU-ZEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG SHOU-ZEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Integrated devices in semiconductor packages and methods of forming same

Package structure and manufacturing method thereof

Sensor packages and manufacturing mehtods thereof

Package structure and manufacturing method thereof

Semiconductor packages and manufacturing methods thereof

Package structure

Structure and formation method of chip package with antenna element

Packaged semiconductor devices and packaging methods

Semiconductor device and manufacturing method thereof

Package structure and method for manufacturing thereof

Semiconductor packages and manufacturing methods thereof

Chip package with antenna element

Packaged semiconductor devices and packaging methods

Chip package with antenna element

Semiconductor packages and manufacturing methods thereof

Integrated devices in semiconductor packages and methods of forming same

Semiconductor device

Packaged semiconductor devices and packaging methods

Package structure and manufacturing method thereof

Package structure, electronic device and method of fabricating package structure

Integrated fan-out package and method of fabricating the same

Semiconductor structure and manufacturing method thereof

Integrated devices in semiconductor packages and methods of forming same

Manufacturing method of a semiconductor device

Integrated devices in semiconductor packages and methods of forming same

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor devices having fin field effect transistor (FinFET) structures and manufacturing and design methods thereof

Package structure with antenna element

Semiconductor packages and manufacturing methods thereof

Package structure

Package structure

Semiconductor packages and manufacturing methods thereof

Semiconductor devices having fin field effect transistor (FinFET) structures and manufacturing and design methods thereof

Package structure, electronic device and method of fabricating package structure

TAIWAN SEMICONDUCTOR MFG

Silicon and arsenic double implanted pre-amorphization process for salicide technology

Method for fabricating raised source/drain structures

Germanium and arsenic double implanted pre-amorphization process for salicide technology

Ti-rich TiN insertion layer for suppression of bridging during a salicide procedure

IO ESD device and methods for forming the same

Strained structure of a semiconductor device

IMEC

Method for fabricating a dual workfunction semiconductor device and the device made thereof

Semiconductor device with reduced diffusion of workfunction modulating element

Method for fabricating a dual workfunction semiconductor device and the device made thereof

POWERCHIP SEMICONDUCTOR MFG CORP

Oxide semiconductor-based FRAM

Bit line structure for two-transistor static random access memory

Circuit structure for testing through silicon vias in three-dimensional integrated circuit

LEE TUNG YING

IO ESD device and methods for forming the same

Semiconductor devices having inactive fin field effect transistor (FinFET) structures and manufacturing and design methods thereof

WANN CLEMENT HSINGJEN

Semiconductor device and method of forming the same