Inventor · disambiguated record
Kwun-Yo Ho
Also filed as: HO KWUN-YO
2 granted patents·1 pending application·75 citations·filing 2003–2005
65Inventor score
Top patents by PatentIndex Score
3 records- 0189US6951773B2Chip packaging structure and manufacturing process thereofVIA TECH INC·Filed 2003·Granted Oct 4, 2005·64 cites·17 claims
- 0259US6716692B1Fabrication process and structure of laminated capacitorVIA TECH INC·Filed 2003·Granted Apr 6, 2004·11 cites·16 claims
- 0341US2005230797A1Chip packaging structureHO KWUN-YO·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →