Inventor
GEFFKEN ROBERT M
US34 patents
⚠️ This page may combine multiple inventors who share the name “GEFFKEN ROBERT M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
32 patentsUS7071532B2Jul 4, 2006
Adjustable self-aligned air gap dielectric for low capacitance wiring
IBM243 citations99
US5985762ANov 16, 1999
Method of forming a self-aligned copper diffusion barrier in vias
IBM284 citations99
US6236103B1May 22, 2001
Integrated high-performance decoupling capacitor and heat sink
IBM93 citations98
US5126006AJun 30, 1992
Plural level chip masking
IBM133 citations97
US4423547AJan 3, 1984
Method for forming dense multilevel interconnection metallurgy for semiconductor devices
IBM245 citations97
US6680514B1Jan 20, 2004
Contact capping local interconnect
IBM48 citations96
US6498385B1Dec 24, 2002
Post-fuse blow corrosion prevention structure for copper fuses
IBM68 citations96
US6452251B1Sep 17, 2002
Damascene metal capacitor
IBM61 citations96
US6426249B1Jul 30, 2002
Buried metal dual damascene plate capacitor
IBM64 citations96
US6344373B1Feb 5, 2002
Antifuse structure and process
IBM45 citations96
US6150723ANov 21, 2000
Copper stud structure with refractory metal liner
IBM71 citations96
US5811870ASep 22, 1998
Antifuse structure
IBM49 citations96
US6495917B1Dec 17, 2002
Method and structure of column interconnect
IBM71 citations95
US5457345AOct 10, 1995
Metallization composite having nickle intermediate/interface
IBM56 citations94
US6939791B2Sep 6, 2005
Contact capping local interconnect
IBM18 citations93
US6888251B2May 3, 2005
Metal spacer in single and dual damascene processing
IBM26 citations93
US6846741B2Jan 25, 2005
Sacrificial metal spacer damascene process
IBM38 citations93
US6746947B2Jun 8, 2004
Post-fuse blow corrosion prevention structure for copper fuses
IBM20 citations93
US6548338B2Apr 15, 2003
Integrated high-performance decoupling capacitor and heat sink
IBM39 citations93
US6300236B1Oct 9, 2001
Copper stud structure with refractory metal liner
IBM33 citations92
US6982227B2Jan 3, 2006
Single and multilevel rework
IBM16 citations91
US6674168B1Jan 6, 2004
Single and multilevel rework
IBM17 citations91
US6503827B1Jan 7, 2003
Method of reducing planarization defects
IBM42 citations91
US6426558B1Jul 30, 2002
Metallurgy for semiconductor devices
IBM28 citations91
US5339212AAug 16, 1994
Sidewall decoupling capacitor
IBM23 citations88
US7358148B2Apr 15, 2008
Adjustable self-aligned air gap dielectric for low capacitance wiring
IBM14 citations84
US7393777B2Jul 1, 2008
Sacrificial metal spacer damascene process
IBM8 citations74
US7381637B2Jun 3, 2008
Metal spacer in single and dual damascence processing
IBM5 citations74
US5585674ADec 17, 1996
Transverse diffusion barrier interconnect structure
IBM14 citations74
US5488013AJan 30, 1996
Method of forming transverse diffusion barrier interconnect structure
IBM14 citations74
US7655547B2Feb 2, 2010
Metal spacer in single and dual damascene processing
IBM2 citations63
US6420263B1Jul 16, 2002
Method for controlling extrusions in aluminum metal lines and the device formed therefrom
IBM2 citations60