Inventor

LIN CHUNG-HSIEN

TW69 patents

⚠️ This page may combine multiple inventors who share the name “LIN CHUNG-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN CHUNG-HSIEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Dual layer microelectromechanical systems device and method of manufacturing same

MEMS devices and fabrication methods thereof

MEMS devices and methods of forming same

MEMS devices and methods of forming same

MEMS devices and fabrication methods thereof

MEMS devices and fabrication methods thereof

Method for fabricating MEMS switch with reduced dielectric charging effect

MEMS devices and methods of forming same

Semiconductor devices with moving members and methods for making the same

Multiple bonding in wafer level packaging

MEMS device with release aperture

MEMS devices and methods of forming same

INVENSENSE INC

Pressure sensor with deformable membrane and method of manufacture

Deformable membrane and a compensating structure thereof

Sensor with integrated heater

Reduced stress pressure sensor

Pressure sensor

Sensor with integrated heater

Pressure sensor with improve hermeticity

Liquid detection in a sensor environment and remedial action thereof

Liquid detection in a sensor environment and remedial action thereof

Pressure sensor and manufacturing method for the same

Pressure sensor with high stability

TAIWAN SEMICONDUCTOR MFG

MEMS structure with adaptable inter-substrate bond

MEMS structure with adaptable inter-substrate bond

Dual layer microelectromechanical systems device and method of manufacturing same

Wafer level packaging

Microstructure device with an improved anchor

MEMS device etch stop

MEMS device etch stop

CHU CHIA-HUA

MEMS device having chip scale packaging

MEMS devices and methods for forming the same

MEMS switch with reduced dielectric charging effect

Package systems having a conductive element through a substrate thereof and manufacturing methods of the same

Semiconductor devices with moving members and methods for making the same

PROLIFIC TECHNOLOGY INC

System for controlling rotational speed of fan according to reference clock frequency

Apparatus for controlling rotational speed of motor

CHEN MENG-WEI

Overlay mark enhancement feature

Overlay mark enhancement feature

LIN CHUNG-HSIEN

MEMS device with release aperture

Multiple bonding in wafer level packaging

HUEILOO CO LTD

Single space rotary printing press for newspapers

Anti-expansion web-transfer mechanism for a color press

LIANG KAI-CHIH

MEMS devices and methods of forming same

ASIA PACIFIC MICROSYSTEMS INC

Film bulk acoustic device with integrated tunable and trimmable device

CHEN TUNG-TSUN

Temperature stabilitized MEMS

CHU RICHARD

Hermetic wafer level packaging

CHENG CHUN-WEN

Wafer level packaging

(unassigned)

Electrical apparatus for assisting mechanical braking in a motor cycle

IND TECH RES INST

Measurement device