Sensor with integrated heater

Abstract

A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.

What is claimed is: 
     
       1. A device comprising:
 a microelectromechanical system (MEMS) sensor die comprising: 
 a deformable membrane; 
 a MEMS heating element integrated within a same layer and a same plane as the deformable membrane; 
 wherein the MEMS heating element is disposed on the outer periphery of the deformable membrane; 
 wherein the MEMS heating element is electrically isolated from the deformable membrane by a trench; 
 wherein the MEMS heating element is configured to generate heat to heat up the deformable membrane. 
 
     
     
       2. The device of  claim 1 , wherein the trench is within a silicon layer. 
     
     
       3. The device of  claim 1 , wherein a material within the trench is selected from a group consisting of Silicon Nitride and Silicon Oxide. 
     
     
       4. The device of  claim 1  further comprising another trench, wherein the another trench is positioned on an outer periphery of the MEMS heating element configured to electrically isolate the MEMS heating element from a peripheral layer. 
     
     
       5. The device of  claim 1 , wherein a periphery of the deformable membrane is positioned on an oxide layer, and wherein the deformable membrane, the oxide layer, and the substrate form a cavity, and wherein the substrate includes an electrode that is formed on a top surface of the substrate that faces the deformable membrane within the cavity. 
     
     
       6. The device of  claim 5 , wherein the MEMS heating element is disposed on the oxide layer. 
     
     
       7. The device of  claim 1 , wherein the MEMS heating element is configured to generate heat for calibration responsive to temperature coefficient of offset (TCO). 
     
     
       8. The device of  claim 7 , wherein the calibration is performed in response to a trigger. 
     
     
       9. The device of  claim 1 , wherein the MEMS heating element is configured to generate heat responsive to detecting presence of liquid on the deformable membrane. 
     
     
       10. A device comprising a microelectromechanical system (MEMS) sensor die comprising:
 a deformable membrane; 
 a MEMS heating element integrated within a same layer and a same plane as the deformable membrane, 
 wherein the MEMS heating element is disposed on a periphery of the deformable membrane and is configured to generate thermal energy to heat up the deformable membrane, and wherein the MEMS heating element has a gap therein, wherein the MEMS heating element surrounds the membrane without fully encompassing the deformable membrane; and 
 a substrate. 
 
     
     
       11. The device of  claim 10  further comprising another MEMS heating element integrated within the same layer and the same plane as the deformable membrane, wherein the MEMS heating element and the another MEMS heating element are separated from one another, and wherein the another MEMS heating element is positioned on the periphery of the deformable membrane and is configured to generate thermal energy to heat up the deformable membrane. 
     
     
       12. The device of  claim 10  further comprising a trench disposed in between the MEMS heating element and the deformable membrane, and wherein the trench comprises a material within the trench is selected from a group consisting of Silicon Nitride and Silicon Oxide. 
     
     
       13. The device of  claim 10 , wherein a periphery of the deformable membrane is disposed on an oxide layer, and wherein the deformable membrane, the oxide layer, and the substrate form a cavity, and wherein the substrate includes an electrode that is formed on a top surface of the substrate that faces the deformable membrane within the cavity, and wherein the MEMS heating element is disposed on the oxide layer. 
     
     
       14. The device of  claim 10 , wherein the deformable membrane is formed from a peripheral layer. 
     
     
       15. The device of  claim 10 , wherein the MEMS heating element is configured to generate heat for calibration responsive to temperature coefficient of offset (TCO) after the MEMS sensor die is soldered on a board. 
     
     
       16. The device of  claim 10 , wherein the MEMS heating element is configured to generate heat responsive to detecting presence of liquid on the deformable membrane. 
     
     
       17. A device comprising a microelectromechanical system (MEMS) sensor die comprising:
 a deformable membrane; 
 a MEMS heating element integrated within a same layer and a same plane as the deformable membrane, 
 wherein the MEMS heating element is disposed on a periphery of the deformable membrane and is configured to generate thermal energy to heat up the deformable membrane; and 
 a substrate, 
 wherein a trench is disposed in between the MEMS heating element and the deformable membrane, and wherein the trench comprises a material within the trench is selected from a group consisting of Silicon Nitride and Silicon Oxide.