Inventor
KO YOUN-SUNG
KR10 patents
⚠️ This page may combine multiple inventors who share the name “KO YOUN-SUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PROTEC CO LTD
7 patentsUS12237296B2Feb 25, 2025
System for laser bonding of flip chip
PROTEC CO LTD1 citations60
US11810890B2Nov 7, 2023
Flip-chip bonding apparatus using VCSEL device
PROTEC CO LTD0 citations59
US10804239B2Oct 13, 2020
Apparatus for mounting conductive ball
PROTEC CO LTD1 citations58
US12568589B2Mar 3, 2026
Method of bonding column type deposits
PROTEC CO LTD0 citations48
US12325088B2Jun 10, 2025
Head assembly for mounting conductive ball
PROTEC CO LTD0 citations47
US12217995B2Feb 4, 2025
Method of mounting conductive balls using electrostatic chuck
PROTEC CO LTD0 citations47
US10804240B2Oct 13, 2020
Method of mounting conductive ball
PROTEC CO LTD0 citations37
SAMSUNG ELECTRONICS CO LTD
3 patentsUS7624498B2Dec 1, 2009
Apparatus for detaching a semiconductor chip from a tape
SAMSUNG ELECTRONICS CO LTD10 citations81
US7650687B2Jan 26, 2010
Die attaching apparatus
SAMSUNG ELECTRONICS CO LTD7 citations70
US7481351B2Jan 27, 2009
Wire bonding apparatus and method for clamping a wire
SAMSUNG ELECTRONICS CO LTD1 citations49