Apparatus for mounting conductive ball

Abstract

Provided is an apparatus for mounting a conductive ball, and more particularly, an apparatus for mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the apparatus for mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without missing any conductive balls.

What is claimed is: 
     
       1. An apparatus for mounting a conductive ball, the apparatus comprising:
 a mask comprising a plurality of mounting holes formed such that a plurality of conductive balls is mounted in the plurality of mounting holes; 
 a support plate supporting the mask to prevent deformation of the mask by blocking a lower portion of each of the plurality of mounting holes by contacting a lower surface of the mask; 
 a mounting unit mounting the plurality of conductive balls in the plurality of mounting holes of the mask while the mask is being supported by the support plate; 
 a holding unit contacting an upper surface of the mask to maintain the conductive balls respectively mounted in the mounting holes of the mask, in a state of being mounted in the mounting holes; 
 a transporting unit placing a substrate below the mask by transporting at least one of the mask, the support plate, and the substrate that is coated with a flux, while the holding unit maintains the conductive balls in the state of being mounted in the mounting holes of the mask; and 
 a controller controlling operation of the mounting unit, the holding unit, and the transporting unit. 
 
     
     
       2. The apparatus of  claim 1 , wherein the holding unit comprises an electrostatic chuck clamping the conductive balls mounted in the mounting holes via an electrostatic force, and
 the controller stops operation of the electrostatic chuck of the holding unit when the substrate is placed below the mask such that the conductive balls mounted in the mounting holes fall onto the substrate. 
 
     
     
       3. The apparatus of  claim 1 , wherein the holding unit comprises a second adsorption member that is formed of a porous material and clamps, by vacuum adsorption, the conductive balls which are mounted in the mounting holes, and
 the controller stops operation of the second adsorption member of the holding unit when the substrate is placed below the mask such that the conductive balls mounted in the mounting holes fall onto the substrate. 
 
     
     
       4. The apparatus of  claim 1 , wherein the support plate comprises a first adsorption member that is formed of a porous material and adsorbs the conductive balls mounted in the mounting holes while the first adsorption member is in contact with the lower surface of the mask, and
 the controller stops operation of the first adsorption member when or before the holding unit operates in contact with the upper surface of the mask. 
 
     
     
       5. The apparatus of  claim 4 , wherein the first adsorption member of the support plate is formed of a transparent material. 
     
     
       6. The apparatus of  claim 5 , wherein the support plate includes a light-emitting portion that contacts the lower surface of the mask to transmit light to the mounting holes of the mask. 
     
     
       7. The apparatus of  claim 6 , further comprising an inspection camera capturing an image of the mask from above the mask to inspect a mounting state of the conductive balls mounted in the mounting holes of the mask,
 wherein the controller inspects a mounting state of the conductive balls mounted in the mounting holes of the mask by using the image captured using the inspection camera. 
 
     
     
       8. The apparatus of  claim 1 , wherein the holding unit operates such that the conductive balls mounted in the mounting holes are brought into contact with the holding unit,
 wherein the apparatus further comprises a separation unit separating, when the controller stops operation of the holding unit, the conductive balls from the holding unit such that the conductive balls fall onto the substrate. 
 
     
     
       9. The apparatus of  claim 8 , wherein the separation unit separates the conductive balls from the holding unit by jetting a compressed air between the mask and the holding unit. 
     
     
       10. The apparatus of  claim 8 , wherein the separation unit separates the conductive balls from the holding unit by moving the mask and the holding unit relative to each other in a horizontal direction. 
     
     
       11. The apparatus of  claim 1 , wherein the transporting unit comprises a support plate transporting unit transporting the support plate relative to the mask, a substrate transporting unit transporting the substrate relative to the mask, and a holding unit transporting unit transporting the holding unit relative to the mask. 
     
     
       12. The apparatus of  claim 1 , wherein the support plate is at least partially formed of a transparent material. 
     
     
       13. The apparatus of  claim 1 , wherein the mounting unit comprises a cyclone head jetting a compressed air to the plurality of conductive balls disposed in a chamber of the cyclone head to mount the plurality of conductive balls in the mounting holes of the mask.