Inventor

MUN SEONGHUN

KR7 patents

⚠️ This page may combine multiple inventors who share the name “MUN SEONGHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

2 patents

US8378476B2Feb 19, 2013

Integrated circuit packaging system with stacking option and method of manufacture thereof

STATS CHIPPAC LTD31 citations92

US9331007B2May 3, 2016

Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages

STATS CHIPPAC LTD3 citations72

LEE SEONGMIN

1 patent

US8779562B2Jul 15, 2014

Integrated circuit packaging system with interposer shield and method of manufacture thereof

LEE SEONGMIN10 citations82

YOON IN SANG

1 patent

US9905491B1Feb 27, 2018

Interposer substrate designs for semiconductor packages

YOON IN SANG5 citations72

YANG DEOKKYUNG

1 patent

US9748203B2Aug 29, 2017

Integrated circuit packaging system with conductive pillars and method of manufacture thereof

YANG DEOKKYUNG3 citations71

KIM KYUNGHWAN

1 patent

US9184067B1Nov 10, 2015

Methods of mitigating defects for semiconductor packages

KIM KYUNGHWAN4 citations70

BAE JOHYUN

1 patent

US8643181B2Feb 4, 2014

Integrated circuit packaging system with encapsulation and method of manufacture thereof

BAE JOHYUN1 citations49