Inventor
GUPTA DINESH
US38 patents
⚠️ This page may combine multiple inventors who share the name “GUPTA DINESH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
23 patentsUS5480503AJan 2, 1996
Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof
IBM127 citations97
US10553522B1Feb 4, 2020
Semiconductor microcooler
IBM20 citations94
US6341417B1Jan 29, 2002
Pre-patterned substrate layers for being personalized as needed
IBM19 citations92
US5601672AFeb 11, 1997
Method for making ceramic substrates from thin and thick ceramic greensheets
IBM42 citations91
US10553516B1Feb 4, 2020
Semiconductor microcooler
IBM10 citations84
US6713686B2Mar 30, 2004
Apparatus and method for repairing electronic packages
IBM16 citations84
US6245185B1Jun 12, 2001
Method of making a multilayer ceramic product with thin layers
IBM7 citations74
US11049844B2Jun 29, 2021
Semiconductor wafer having trenches with varied dimensions for multi-chip modules
IBM3 citations73
US10943883B1Mar 9, 2021
Planar wafer level fan-out of multi-chip modules having different size chips
IBM6 citations73
US10490480B1Nov 26, 2019
Copper microcooler structure and fabrication
IBM4 citations73
US10490481B1Nov 26, 2019
Copper microcooler structure and fabrication
IBM3 citations73
US6475555B2Nov 5, 2002
Process for screening features on an electronic substrate with a low viscosity paste
IBM7 citations73
US6231707B1May 15, 2001
Method of forming a multilayer ceramic substrate with max-punched vias
IBM8 citations73
US10580738B2Mar 3, 2020
Direct bonded heterogeneous integration packaging structures
IBM4 citations71
US5655209AAug 5, 1997
Multilayer ceramic substrates having internal capacitor, and process for producing same
IBM12 citations69
US11056418B2Jul 6, 2021
Semiconductor microcooler
IBM0 citations62
US11049789B2Jun 29, 2021
Semiconductor microcooler
IBM0 citations62
US11462512B2Oct 4, 2022
Three-dimensional microelectronic package with embedded cooling channels
IBM0 citations61
US11177217B2Nov 16, 2021
Direct bonded heterogeneous integration packaging structures
IBM0 citations61
US10937764B2Mar 2, 2021
Three-dimensional microelectronic package with embedded cooling channels
IBM1 citations61
US6631675B2Oct 14, 2003
Screening method for double pass screening
IBM5 citations58
US6662718B2Dec 16, 2003
Screening mask having a stress-relieving area
IBM2 citations53
US6836015B2Dec 28, 2004
Optical assemblies for transmitting and manipulating optical beams
IBM1 citations50
CADENCE DESIGN SYSTEMS INC
4 patentsUS8365113B1Jan 29, 2013
Flow methodology for single pass parallel hierarchical timing closure of integrated circuit designs
CADENCE DESIGN SYSTEMS INC51 citations97
US7926011B1Apr 12, 2011
System and method of generating hierarchical block-level timing constraints from chip-level timing constraints
CADENCE DESIGN SYSTEMS INC16 citations91
US9152742B1Oct 6, 2015
Multi-phase models for timing closure of integrated circuit designs
CADENCE DESIGN SYSTEMS INC6 citations84
US9165098B1Oct 20, 2015
Machine readable products for single pass parallel hierarchical timing closure of integrated circuit designs
CADENCE DESIGN SYSTEMS INC5 citations83
GOLDMAN SACHS & CO LLC
3 patentsUS12242468B1Mar 4, 2025
Generative machine learning with retriever having reconfigurable sequence of rankers
GOLDMAN SACHS & CO LLC10 citations76
US12321794B2Jun 3, 2025
Hybrid language model architecture for API orchestration including chain of thought
GOLDMAN SACHS & CO LLC2 citations62
US12518171B2Jan 6, 2026
Data generation and retraining techniques for fine-tuning of embedding models for efficient data retrieval
GOLDMAN SACHS & CO LLC0 citations49
GUPTA DINESH
2 patentsBHARDWAJ VIVEK
2 patentsTRANSWITCH CORP
2 patentsUS7558287B2Jul 7, 2009
Combined hardware and software implementation of link capacity adjustment scheme (LCAS) in SONET (synchronous optical network) virtual concatenation (VCAT)
TRANSWITCH CORP3 citations55
US7672315B2Mar 2, 2010
Methods and apparatus for deskewing VCAT/LCAS members
TRANSWITCH CORP0 citations33