P

Inventor

GUPTA DINESH

US38 patents
⚠️ This page may combine multiple inventors who share the name “GUPTA DINESH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

23 patents
US5480503AJan 2, 1996

Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof

IBM127 citations97
US10553522B1Feb 4, 2020

Semiconductor microcooler

IBM20 citations94
US6341417B1Jan 29, 2002

Pre-patterned substrate layers for being personalized as needed

IBM19 citations92
US5601672AFeb 11, 1997

Method for making ceramic substrates from thin and thick ceramic greensheets

IBM42 citations91
US10553516B1Feb 4, 2020

Semiconductor microcooler

IBM10 citations84
US6713686B2Mar 30, 2004

Apparatus and method for repairing electronic packages

IBM16 citations84
US6245185B1Jun 12, 2001

Method of making a multilayer ceramic product with thin layers

IBM7 citations74
US11049844B2Jun 29, 2021

Semiconductor wafer having trenches with varied dimensions for multi-chip modules

IBM3 citations73
US10943883B1Mar 9, 2021

Planar wafer level fan-out of multi-chip modules having different size chips

IBM6 citations73
US10490480B1Nov 26, 2019

Copper microcooler structure and fabrication

IBM4 citations73
US10490481B1Nov 26, 2019

Copper microcooler structure and fabrication

IBM3 citations73
US6475555B2Nov 5, 2002

Process for screening features on an electronic substrate with a low viscosity paste

IBM7 citations73
US6231707B1May 15, 2001

Method of forming a multilayer ceramic substrate with max-punched vias

IBM8 citations73
US10580738B2Mar 3, 2020

Direct bonded heterogeneous integration packaging structures

IBM4 citations71
US5655209AAug 5, 1997

Multilayer ceramic substrates having internal capacitor, and process for producing same

IBM12 citations69
US11056418B2Jul 6, 2021

Semiconductor microcooler

IBM0 citations62
US11049789B2Jun 29, 2021

Semiconductor microcooler

IBM0 citations62
US11462512B2Oct 4, 2022

Three-dimensional microelectronic package with embedded cooling channels

IBM0 citations61
US11177217B2Nov 16, 2021

Direct bonded heterogeneous integration packaging structures

IBM0 citations61
US10937764B2Mar 2, 2021

Three-dimensional microelectronic package with embedded cooling channels

IBM1 citations61
US6631675B2Oct 14, 2003

Screening method for double pass screening

IBM5 citations58
US6662718B2Dec 16, 2003

Screening mask having a stress-relieving area

IBM2 citations53
US6836015B2Dec 28, 2004

Optical assemblies for transmitting and manipulating optical beams

IBM1 citations50

CADENCE DESIGN SYSTEMS INC

4 patents

GOLDMAN SACHS & CO LLC

3 patents

GUPTA DINESH

2 patents

BHARDWAJ VIVEK

2 patents

TRANSWITCH CORP

2 patents

UNITED TECHNOLOGIES CORP

1 patent

LEVITSKY OLEG

1 patent