Inventor
MORRIS THOMAS SCOTT
US33 patents
⚠️ This page may combine multiple inventors who share the name “MORRIS THOMAS SCOTT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QORVO US INC
18 patentsUS9960145B2May 1, 2018
Flip chip module with enhanced properties
QORVO US INC15 citations83
US10905007B1Jan 26, 2021
Contact pads for electronic substrates and related methods
QORVO US INC2 citations71
US9646857B2May 9, 2017
Low pressure encapsulant for size-reduced semiconductor package
QORVO US INC3 citations70
US11219144B2Jan 4, 2022
Electromagnetic shields for sub-modules
QORVO US INC0 citations61
US11058038B2Jul 6, 2021
Electromagnetic shields for sub-modules
QORVO US INC0 citations61
US11765826B2Sep 19, 2023
Method of fabricating contact pads for electronic substrates
QORVO US INC0 citations60
US10888040B2Jan 5, 2021
Double-sided module with electromagnetic shielding
QORVO US INC1 citations60
US12231109B2Feb 18, 2025
Electronic device with solder interconnect and multiple material encapsulant
QORVO US INC0 citations59
US11127689B2Sep 21, 2021
Segmented shielding using wirebonds
QORVO US INC0 citations53
US11024541B2Jun 1, 2021
Process for molding a back side wafer singulation guide
QORVO US INC0 citations53
US11387190B2Jul 12, 2022
Shielded electronic modules and methods of forming the same utilizing plating and double-cut singulation
QORVO US INC1 citations51
US10607960B2Mar 31, 2020
Substrate structure with selective surface finishes for flip chip assembly
QORVO US INC0 citations51
US10283480B2May 7, 2019
Substrate structure with selective surface finishes for flip chip assembly
QORVO US INC0 citations51
US9935066B2Apr 3, 2018
Semiconductor package having a substrate structure with selective surface finishes
QORVO US INC1 citations51
US12342518B2Jun 24, 2025
Compartmentalized shielding of a module utilizing self-shielded sub-modules
QORVO US INC0 citations46
US10777524B2Sep 15, 2020
Using an interconnect bump to traverse through a passivation layer of a semiconductor die
QORVO US INC0 citations45
US10811364B2Oct 20, 2020
Shielded electronic modules and methods of forming the same utilizing plating and double-cut singulation
QORVO US INC0 citations41
US10553545B2Feb 4, 2020
Electromagnetic shielding for integrated circuit modules
QORVO US INC0 citations34
RF MICRO DEVICES INC
8 patentsUS9613831B2Apr 4, 2017
Encapsulated dies with enhanced thermal performance
RF MICRO DEVICES INC64 citations97
US7451539B2Nov 18, 2008
Method of making a conformal electromagnetic interference shield
RF MICRO DEVICES INC89 citations95
US9661739B2May 23, 2017
Electronic modules having grounded electromagnetic shields
RF MICRO DEVICES INC6 citations83
US7999197B1Aug 16, 2011
Dual sided electronic module
RF MICRO DEVICES INC7 citations82
US10020206B2Jul 10, 2018
Encapsulated dies with enhanced thermal performance
RF MICRO DEVICES INC2 citations72
US9420704B2Aug 16, 2016
Connection using conductive vias
RF MICRO DEVICES INC3 citations72
US6884661B1Apr 26, 2005
Method of fabricating posts over integrated heat sink metallization to enable flip chip packaging of GaAs devices
RF MICRO DEVICES INC8 citations72
US9942994B2Apr 10, 2018
Connection using conductive vias
RF MICRO DEVICES INC0 citations51