Electronic device with solder interconnect and multiple material encapsulant

Abstract

The disclosure is directed to an electronic device with a solder interconnect and multiple material encapsulant. The electronic device includes a die last assembly with the die assembled to an electronic packaging substrate by a solder interconnect. At least a portion of a first dielectric material and the die are milled or ground, with a second dielectric material applied over an exposed portion of the die. A shield is then positioned over and electrically insulated from the die. Accordingly, such a configuration reduces a thickness or height of an electronic device with shielding and a die last assembly.

What is claimed is: 
     
       1. An electronic device, comprising:
 an electronic packaging substrate with conductor trace; 
 a first die comprising:
 an electronic component; and 
 a solder interconnect electrically coupling the electronic component to the electronic packaging substrate; and 
 
 an encapsulant surrounding the first die and comprising:
 a first dielectric material at a periphery of the electronic component and below the electronic component and adjacent to the solder interconnect, the first dielectric material being located at the periphery of the electronic component and having a first thickness; 
 a second dielectric material at a top of the first die, the second dielectric material having a second thickness less than the first thickness; and 
 a shield covering the encapsulant, the shield including a top wall positioned on the second dielectric material and a side wall that extends along a perimeter of the encapsulant and is attached to the encapsulant. 
 
 
     
     
       2. The electronic device of  claim 1 , wherein the electronic packaging substrate comprises a redistribution layer. 
     
     
       3. The electronic device of  claim 1 , wherein the electronic packaging substrate comprises a laminate. 
     
     
       4. The electronic device of  claim 1 , wherein:
 the first die comprises a Bulk Acoustic Wave, BAW, filter die; and 
 the electronic component comprises a BAW filter. 
 
     
     
       5. The electronic device of  claim 1 , wherein the first die includes at least one of silicon, Gallium Arsenide, or Gallium Nitride. 
     
     
       6. The electronic device of  claim 5 , wherein a Bulk Acoustic Wave, BAW, filter die includes an air cavity structure. 
     
     
       7. The electronic device of  claim 5 , wherein the first die is devoid of an air cavity structure. 
     
     
       8. The electronic device of  claim 1 , wherein the electronic component further comprises conductive pillars, the solder interconnect at an end of the conductive pillars; and
 the first dielectric material of an overmold is between the conductive pillars. 
 
     
     
       9. The electronic device of  claim 1 , wherein the encapsulant comprises an epoxy mold compound. 
     
     
       10. The electronic device of  claim 1 , wherein the second dielectric material is more thermally conductive than the first dielectric material. 
     
     
       11. The electronic device of  claim 1 , wherein the encapsulant comprises:
 an overmold comprising the first dielectric material; and 
 a thin film comprising the second dielectric material. 
 
     
     
       12. The electronic device of  claim 11 , wherein the thin film is within a single plane. 
     
     
       13. The electronic device of  claim 1 , further comprising:
 a second die comprising:
 an electronic component; and 
 a solder interconnect electrically coupling the electronic component to the electronic packaging substrate; 
 
 wherein the second dielectric material integrally extends over the first die and the second die; and 
 wherein the shield covers the first die and the second die. 
 
     
     
       14. The electronic device of  claim 1 , wherein the first die and the second die are ground to a same height relative to the electronic packaging substrate. 
     
     
       15. A method of manufacturing an electronic device, comprising:
 assembling a first die to an electronic packaging substrate such that solder interconnects of the first die couple an electronic component of the first die with the electronic packaging substrate; 
 forming a body portion of an encapsulant around the first die and below the electronic component between the solder interconnects, the body portion comprising a first dielectric material; 
 removing at least a portion of the encapsulant and the first die to form an exposed portion of the first die; 
 forming a second dielectric material to cover the exposed portion of the first die; and 
 applying a shield to cover the encapsulant, the shield including a top wall positioned on the second dielectric material and a side wall that extends along a perimeter of the encapsulant and is attached to the encapsulant. 
 
     
     
       16. The method of  claim 15 , wherein:
 the first die comprises a Bulk Acoustic Wave, BAW, filter die; and 
 the electronic component comprises a BAW filter. 
 
     
     
       17. The method of  claim 15 , wherein the second dielectric material of a film is more thermally conductive than the first dielectric material of the body portion. 
     
     
       18. The method of  claim 15 , further comprising:
 forming the second dielectric material to integrally extend over the first die and a second die. 
 
     
     
       19. The method of  claim 15 , further comprising grinding down a second die to form an exposed portion of the second die.