Inventor
Glascock Howard Terry
US3 patents
Patents
3 patentsUS9646857B2May 9, 2017
Low pressure encapsulant for size-reduced semiconductor package
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US12231109B2Feb 18, 2025
Electronic device with solder interconnect and multiple material encapsulant
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US12342518B2Jun 24, 2025
Compartmentalized shielding of a module utilizing self-shielded sub-modules
QORVO US INC0 citations46