Inventor · disambiguated record
Sung-Hoan Kim
Also filed as: KIM SUNG-HOAN
11 granted patents·2 pending applications·58 citations·filing 2000–2019
88Inventor score
Top patents by PatentIndex Score
13 records- 0182US10665549B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 26, 2020·4 cites·19 claims
- 0277US7304387B2Semiconductor integrated circuit deviceSAMSUNG ELECRONICS CO LTD·Filed 2006·Granted Dec 4, 2007·6 cites·13 claims
- 0376US7465978B2Field effect transistor with a high breakdown voltage and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Dec 16, 2008·6 cites·7 claims
- 0468US8058185B2Method of fabricating semiconductor integrated circuit deviceCHANG DONG-RYUL·Filed 2007·Granted Nov 15, 2011·3 cites·14 claims
- 0567US6709931B2Fabrication of semiconductor devices having high-voltage MOS transistors and low-voltage MOS transistorsSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Mar 23, 2004·16 cites·17 claims
- 0662US6682986B2Method of forming shallow trench isolation and method of manufacturing a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jan 27, 2004·12 cites·26 claims
- 0755US7029987B2Method of manufacturing semiconductor device having shallow trench isolation (STI)SAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Apr 18, 2006·7 cites·37 claims
- 0848US6459115B1Semiconductor memory capacitor with intra-dielectric conductive sidewall spacerSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Oct 1, 2002·4 cites·10 claims
- 0948US2012032269A1Semiconductor integrated circuit device and method for fabricating the sameCHANG DONG-RYUL·Filed 2011·Application pending·0 cites
- 1043US11244921B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 8, 2022·0 cites·20 claims
- 1138US7033896B2Field effect transistor with a high breakdown voltage and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Apr 25, 2006·0 cites·9 claims
- 1236US11171107B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 9, 2021·0 cites·19 claims
- 1333US2002111046A1Semiconductor device fabricating methodSAMSUNG ELECTRONICS CO LTD·Filed 2001·Application pending·0 cites
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