P

Inventor

OGAWA ARITO

JP59 patents
⚠️ This page may combine multiple inventors who share the name “OGAWA ARITO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOKUSAI ELECTRIC CORP

22 patents
US12469707B2Nov 11, 2025

Method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatus

KOKUSAI ELECTRIC CORP0 citations62
US12451360B2Oct 21, 2025

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations62
US12084757B2Sep 10, 2024

Method of manufacturing semiconductor device, substrate processing apparatus, method of processing substrate, and recording medium

KOKUSAI ELECTRIC CORP0 citations62
US12080555B2Sep 3, 2024

Method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatus

KOKUSAI ELECTRIC CORP0 citations62
US11967500B2Apr 23, 2024

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations62
US11915938B2Feb 27, 2024

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations62
US11908737B2Feb 20, 2024

Method of manufacturing semiconductor device, substrate processing apparatus and recording medium

KOKUSAI ELECTRIC CORP0 citations62
US11538688B2Dec 27, 2022

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations62
US11424127B2Aug 23, 2022

Method of manufacturing semiconductor device, substrate processing apparatus, method of processing substrate, and recording medium

KOKUSAI ELECTRIC CORP0 citations62
US10388530B2Aug 20, 2019

Method of manufacturing semiconductor device and substrate processing apparatus

KOKUSAI ELECTRIC CORP1 citations62
US12463031B2Nov 4, 2025

Method of processing substrate, recording medium, and substrate processing apparatus

KOKUSAI ELECTRIC CORP0 citations61
US12148621B2Nov 19, 2024

Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus

KOKUSAI ELECTRIC CORP0 citations61
US12084760B2Sep 10, 2024

Method of processing substrate, recording medium, substrate processing apparatus, and method of manufacturing semiconductor device

KOKUSAI ELECTRIC CORP0 citations61
US11621169B2Apr 4, 2023

Method of manufacturing semiconductor device, recording medium, and substrate processing apparatus

KOKUSAI ELECTRIC CORP0 citations61
US12148614B2Nov 19, 2024

Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium

KOKUSAI ELECTRIC CORP0 citations58
US12170206B2Dec 17, 2024

Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus

KOKUSAI ELECTRIC CORP0 citations57
US12469713B2Nov 11, 2025

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations54
US12278108B2Apr 15, 2025

Substrate processing method, method of manufacturing semiconductor device, non- transitory computer-readable recording medium and substrate processing apparatus

KOKUSAI ELECTRIC CORP0 citations54
US12540392B2Feb 3, 2026

Method of manufacturing semiconductor device, substrate processing apparatus, recording medium, and method of processing substrate

KOKUSAI ELECTRIC CORP0 citations52
US12139792B2Nov 12, 2024

Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device and non-transitory computer-readable recording medium

KOKUSAI ELECTRIC CORP0 citations52
US11004676B2May 11, 2021

Method for manufacturing semiconductor device, non-transitory computer-readable recording medium, and substrate processing apparatus

KOKUSAI ELECTRIC CORP0 citations51
US10734218B2Aug 4, 2020

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

KOKUSAI ELECTRIC CORP0 citations51

HITACHI INT ELECTRIC INC

20 patents
US9508555B2Nov 29, 2016

Method of manufacturing semiconductor device

HITACHI INT ELECTRIC INC8 citations82
US9472637B2Oct 18, 2016

Semiconductor device having electrode made of high work function material and method of manufacturing the same

HITACHI INT ELECTRIC INC3 citations73
US9745656B2Aug 29, 2017

Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording medium

HITACHI INT ELECTRIC INC1 citations63
US9425039B2Aug 23, 2016

Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium

HITACHI INT ELECTRIC INC2 citations63
US9406520B2Aug 2, 2016

Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording medium

HITACHI INT ELECTRIC INC1 citations63
US9378964B2Jun 28, 2016

Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording medium

HITACHI INT ELECTRIC INC1 citations63
US9355850B2May 31, 2016

Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording medium

HITACHI INT ELECTRIC INC1 citations63
US9123644B2Sep 1, 2015

Semiconductor device, method of manufacturing semiconductor device and system of processing substrate

HITACHI INT ELECTRIC INC2 citations63
US9012323B2Apr 21, 2015

Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording medium

HITACHI INT ELECTRIC INC2 citations63
US10410870B2Sep 10, 2019

Method of manufacturing semiconductor device

HITACHI INT ELECTRIC INC1 citations62
US8367560B2Feb 5, 2013

Semiconductor device manufacturing method

HITACHI INT ELECTRIC INC2 citations62
US9666439B2May 30, 2017

Method of manufacturing a semiconductor device and recording medium

HITACHI INT ELECTRIC INC0 citations52
US9653301B2May 16, 2017

Semiconductor device having electrode made of high work function material, method and apparatus for manufacturing the same

HITACHI INT ELECTRIC INC0 citations52
US9437704B2Sep 6, 2016

Semiconductor device having electrode made of high work function material, method and apparatus for manufacturing the same

HITACHI INT ELECTRIC INC1 citations52
US9190281B2Nov 17, 2015

Method of manufacturing semiconductor device

HITACHI INT ELECTRIC INC1 citations52
US9082747B2Jul 14, 2015

Method, apparatus, and non-transitory computer readable recording medium for manufacturing a semiconductor device with an amorphous oxide film

HITACHI INT ELECTRIC INC0 citations52
US9059089B2Jun 16, 2015

Method of manufacturing semiconductor device

HITACHI INT ELECTRIC INC1 citations52
US8741731B2Jun 3, 2014

Method of manufacturing a semiconductor device

HITACHI INT ELECTRIC INC1 citations52
US10121651B2Nov 6, 2018

Method of manufacturing semiconductor device

HITACHI INT ELECTRIC INC0 citations51
US9368358B2Jun 14, 2016

Method of manufacturing a semiconductor device

HITACHI INT ELECTRIC INC0 citations51

OGAWA ARITO

4 patents

TAKEBAYASHI YUJI

1 patent

HITACHI LTD

1 patent

KOKUSAI ELECTRIC COPORATION

1 patent

ROHM CO LTD

1 patent

Showing the top 50 of 59 patents by PatentIndex Score.