Inventor
YUAN FENG
CN98 patents
⚠️ This page may combine multiple inventors who share the name “YUAN FENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
15 patentsUS9564529B2Feb 7, 2017
Method for fabricating a strained structure and structure formed
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations93
US9419134B2Aug 16, 2016
Strain enhancement for FinFETs
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11508658B2Nov 22, 2022
Semiconductor device package and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11387360B2Jul 12, 2022
Transistor with a negative capacitance and a method of creating the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10707347B2Jul 7, 2020
Transistor with a negative capacitance and a method of creating the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9997616B2Jun 12, 2018
Semiconductor device having a strained region
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9721829B2Aug 1, 2017
FinFETs with different fin height and EPI height setting
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9711412B2Jul 18, 2017
FinFETs with different fin heights
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12237227B2Feb 25, 2025
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12356674B2Jul 8, 2025
Method for fabricating a strained structure and structure formed
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11855210B2Dec 26, 2023
Method for fabricating a strained structure and structure formed
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11677004B2Jun 13, 2023
Strained channel field effect transistor
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11626328B2Apr 11, 2023
Strain enhancement for FinFETs
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11251303B2Feb 15, 2022
Method for fabricating a strained structure and structure formed
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11158725B2Oct 26, 2021
Fin structure of fin field effect transistor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
TAIWAN SEMICONDUCTOR MFG
11 patentsUS8373238B2Feb 12, 2013
FinFETs with multiple Fin heights
TAIWAN SEMICONDUCTOR MFG39 citations98
US9147594B2Sep 29, 2015
Method for fabricating a strained structure
TAIWAN SEMICONDUCTOR MFG13 citations93
US8748993B2Jun 10, 2014
FinFETs with multiple fin heights
TAIWAN SEMICONDUCTOR MFG18 citations93
US8673709B2Mar 18, 2014
FinFETs with multiple fin heights
TAIWAN SEMICONDUCTOR MFG17 citations93
US8373229B2Feb 12, 2013
Gate controlled bipolar junction transistor on fin-like field effect transistor (FinFET) structure
TAIWAN SEMICONDUCTOR MFG23 citations92
US9257344B2Feb 9, 2016
FinFETs with different fin height and EPI height setting
TAIWAN SEMICONDUCTOR MFG5 citations84
US9112052B2Aug 18, 2015
Voids in STI regions for forming bulk FinFETs
TAIWAN SEMICONDUCTOR MFG10 citations84
US9087725B2Jul 21, 2015
FinFETs with different fin height and EPI height setting
TAIWAN SEMICONDUCTOR MFG11 citations84
US8878308B2Nov 4, 2014
Multi-fin device by self-aligned castle fin formation
TAIWAN SEMICONDUCTOR MFG8 citations84
US8846466B2Sep 30, 2014
Forming inter-device STI regions and intra-device STI regions using different dielectric materials
TAIWAN SEMICONDUCTOR MFG5 citations84
US8723271B2May 13, 2014
Voids in STI regions for forming bulk FinFETs
TAIWAN SEMICONDUCTOR MFG12 citations84
LEE TSUNG-LIN
6 patentsUS9171929B2Oct 27, 2015
Strained structure of semiconductor device and method of making the strained structure
LEE TSUNG-LIN593 citations99
US8847293B2Sep 30, 2014
Gate structure for semiconductor device
LEE TSUNG-LIN518 citations99
US8497528B2Jul 30, 2013
Method for fabricating a strained structure
LEE TSUNG-LIN241 citations99
US8941153B2Jan 27, 2015
FinFETs with different fin heights
LEE TSUNG-LIN46 citations98
US8445340B2May 21, 2013
Sacrificial offset protection film for a FinFET device
LEE TSUNG-LIN21 citations93
US9263342B2Feb 16, 2016
Semiconductor device having a strained region
LEE TSUNG-LIN13 citations84
YUAN FENG
3 patentsUS9953885B2Apr 24, 2018
STI shape near fin bottom of Si fin in bulk FinFET
YUAN FENG24 citations94
US8519481B2Aug 27, 2013
Voids in STI regions for forming bulk FinFETs
YUAN FENG35 citations94
US8592918B2Nov 26, 2013
Forming inter-device STI regions and intra-device STI regions using different dielectric materials
YUAN FENG8 citations84
GOOGLE INC
2 patentsMICROSOFT CORP
2 patentsVIVO MOBILE COMMUNICATION CO LTD
2 patentsCHEN HSIN-CHIH
1 patentYANG FAN
1 patentVAN DAL MARK
1 patentCHERVON HK LTD
1 patentCHERVON IP LTD
1 patentMAYBEE PAUL
1 patentGOOGLE LLC
1 patentRAMASWAMY SUBRAMANIAN
1 patentHEWLETT PACKARD DEVELOPMENT CO
1 patentShowing the top 50 of 98 patents by PatentIndex Score.