P

Inventor

AVANZINO STEVEN

US43 patents
⚠️ This page may combine multiple inventors who share the name “AVANZINO STEVEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED MICRO DEVICES INC

22 patents
US5705430AJan 6, 1998

Dual damascene with a sacrificial via fill

ADVANCED MICRO DEVICES INC173 citations99
US5614765AMar 25, 1997

Self aligned via dual damascene

ADVANCED MICRO DEVICES INC172 citations99
US5795823AAug 18, 1998

Self aligned via dual damascene

ADVANCED MICRO DEVICES INC114 citations98
US6143656ANov 7, 2000

Slurry for chemical mechanical polishing of copper

ADVANCED MICRO DEVICES INC67 citations96
US5691238ANov 25, 1997

Subtractive dual damascene

ADVANCED MICRO DEVICES INC68 citations96
US5686354ANov 11, 1997

Dual damascene with a protective mask for via etching

ADVANCED MICRO DEVICES INC80 citations96
US5837618ANov 17, 1998

Uniform nonconformal deposition for forming low dielectric constant insulation between certain conductive lines

ADVANCED MICRO DEVICES INC53 citations95
US5776834AJul 7, 1998

Bias plasma deposition for selective low dielectric insulation

ADVANCED MICRO DEVICES INC45 citations95
US7071564B1Jul 4, 2006

Composite tantalum capped inlaid copper with reduced electromigration and reduced stress migration

ADVANCED MICRO DEVICES INC29 citations93
US5990557ANov 23, 1999

Bias plasma deposition for selective low dielectric insulation

ADVANCED MICRO DEVICES INC18 citations92
US5955786ASep 21, 1999

Semiconductor device using uniform nonconformal deposition for forming low dielectric constant insulation between certain conductive lines

ADVANCED MICRO DEVICES INC20 citations92
US5770519AJun 23, 1998

Copper reservoir for reducing electromigration effects associated with a conductive via in a semiconductor device

ADVANCED MICRO DEVICES INC49 citations92
US5691573ANov 25, 1997

Composite insulation with a dielectric constant of less than 3 in a narrow space separating conductive lines

ADVANCED MICRO DEVICES INC44 citations92
US5639691AJun 17, 1997

Copper pellet for reducing electromigration effects associated with a conductive via in a semiconductor device

ADVANCED MICRO DEVICES INC19 citations92
US6051882AApr 18, 2000

Subtractive dual damascene semiconductor device

ADVANCED MICRO DEVICES INC17 citations90
US6422918B1Jul 23, 2002

Chemical-mechanical polishing of photoresist layer

ADVANCED MICRO DEVICES INC14 citations81
US6048802AApr 11, 2000

Selective nonconformal deposition for forming low dielectric insulation between certain conductive lines

ADVANCED MICRO DEVICES INC15 citations73
US5646448AJul 8, 1997

Copper pellet for reducing electromigration effects associated with a conductive via in a semiconductor device

ADVANCED MICRO DEVICES INC7 citations73
US6465156B1Oct 15, 2002

Method for mitigating formation of silicon grass

ADVANCED MICRO DEVICES INC3 citations63
US6352817B1Mar 5, 2002

Methodology for mitigating formation of t-tops in photoresist

ADVANCED MICRO DEVICES INC2 citations63
US6332989B1Dec 25, 2001

Slurry for chemical mechanical polishing of copper

ADVANCED MICRO DEVICES INC3 citations63
US6518185B1Feb 11, 2003

Integration scheme for non-feature-size dependent cu-alloy introduction

ADVANCED MICRO DEVICES INC5 citations62

SPANSION LLC

12 patents

RATHOR MANUJ

4 patents

PANGRLE SUZETTE K

3 patents

AVANZINO STEVEN

2 patents