Inventor

OSENBACH JOHN WILLIAM

US29 patents

⚠️ This page may combine multiple inventors who share the name “OSENBACH JOHN WILLIAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OSENBACH JOHN WILLIAM

AGERE SYSTEMS INC

Kinetically controlled solder

Plastic packaged optoelectronic device

Reinforced bond pad

Electro-optic device including a buffer layer of transparent conductive material

Techniques for reducing bowing in power transistor devices

Semiconductor device package with base features to reduce leakage

Non-hermetic APD

Method of making electronic entities

Methods and apparatus to reduce growth formations on plated conductive leads

Integrated circuit package including wire bonds

Electronic packages

Manufacture of devices including solder bumps

Device packages

Device package

LUCENT TECHNOLOGIES INC

Process for passivating semiconductor laser structures with severe steps in surface topography

Method and compositions for achieving a kinetically controlled solder bond

Optical devices having improved temperature stability

Method for improved metal oxide bonding of optical elements

Active optical alignment using MEMS mirrors

Bonding of aluminum oxide components to silicons substrates

Corrosion protection in the fabrication of optoelectronic assemblies

Bonding of aluminum oxide components to silicon substrates

TRIQUINT TECHNOLOGY HOLDING CO

Silicon-based high speed optical wiring board

Optical component package

AGERE SYST GUARDIAN CORP

Plastic packaged optoelectronic device

Kinetically controlled solder bonding

LSI CORP

Semiconductor device package with reduced leakage

AGERE SYST OPTOELECTRONICS

Optical waveguide device with enhanced stability

TRI QUINT TECHNOLOGY HOLDING C

Multimode fiber communication system with enhanced bandwidth