Inventor

GRAF ECKHARD

DE21 patents

⚠️ This page may combine multiple inventors who share the name “GRAF ECKHARD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GRAF ECKHARD

BOSCH GMBH ROBERT

Method for sectioning a substrate wafer into a plurality of substrate chips

Method of producing acceleration sensors

Method for manufacturing a micromechanical component and a component that is manufactured in accordance with the method

Micromechanical component as well as a method for producing a micromechanical component

Micromechanical component

Bonding pad structure and method for manufacturing the bonding pad structure

Micromechanical component as well as a method for producing a micromechanical component

Method for joining a silicon plate to a second plate

Micromechanical device and method for manufacturing a micromechanical device

Micromechanical cap structure and a corresponding production method

MEMS component having two different internal pressures

SCHEUERER ROLAND

Method for producing a micromechanical component having a trench structure for backside contact

Method for producing a micromechanical component having a filler layer and a masking layer

Method for producing a micromechanical component having a trench structure for backside contact

UHRIG KANALTECHNIK GMBH

Inside sealing device sleeve for insertion of pipes

Apparatus for sealing leakage points in pipes from the inside of the pipe, and a method of sealing the leakage points

FREY JENS

Sensor module

Method for filling cavities in wafers, correspondingly filled blind hole and wafer having correspondingly filled insulation trenches

FISCHER FRANK

Micromechanical component having multiple caverns, and manufacturing method

REINMUTH JOCHEN

Method for establishing and closing a trench of a semiconductor component

GONSKA JULIAN

Component having a via and method for manufacturing it