Method for producing a micromechanical component having a filler layer and a masking layer

Abstract

A method for producing a micromechanical component is proposed, a trench structure being substantially completely filled up by a first filler layer, and a first mask layer being applied on the first filler layer, on which in turn a second filler layer and a second mask layer are applied. A micromechanical component is also proposed, the first filler layer filling up the trench structure of the micromechanical component and at the same time forming a movable sensor structure.

What is claimed is: 
     
       1. A method for producing a micromechanical component comprising:
 generating a trench structure in a substrate material proceeding from a first side, wherein the trench structure is substantially completely filled up by a first filler layer, 
 applying a first mask layer onto the first filler layer, 
 applying a second filler layer over the first mask layer, and 
 applying a second mask layer over the second filler layer, 
 wherein the micromechanical component is planarized from a second side of the substrate material as far as a plane of the trench structure. 
 
     
     
       2. The method for producing a micromechanical component as recited in  claim 1 , wherein before the first filler layer, a third mask layer and a first insulating layer are applied on the substrate material. 
     
     
       3. The method for producing a micromechanical component as recited in  claim 1 , wherein at least one of the first filler layer and the second filler layer are applied so as to cover the first side of the substrate material substantially completely. 
     
     
       4. The method for producing a micromechanical component as recited in  claim 1 , wherein the first filler layer is planarized, proceeding from the first side of the substrate material, before the first mask layer is applied. 
     
     
       5. The method for producing a micromechanical component as recited in  claim 1 , wherein the second filler layer is planarized, proceeding from the first side of the substrate material, prior to application of the second mask layer. 
     
     
       6. The method for producing a micromechanical component as recited in  claim 1 , wherein in an etching step, at least one of a further trench structure, a spacing element and sensor structures are formed. 
     
     
       7. The method for producing a micromechanical component as recited in  claim 6 , wherein movable sensor structures are formed at least in part from the sensor structures by way of a further etching step, the movable sensor structures in the micromechanical component being formed from the first filler layer. 
     
     
       8. The method for producing a micromechanical component as recited in  claim 6 , wherein a cap wafer is connected by anodic bonding or seal-glass bonding to a spacing element or to monocrystalline or polycrystalline regions, or a cap wafer is connected by seal-glass bonding to the sensor structure or to the monocrystalline or polycrystalline regions. 
     
     
       9. A micromechanical component produced according to the method of  claim 7 , wherein the trench structure is filled up substantially completely by the first filler layer, the first filler layer constituting the movable sensor structures and the sensor structures. 
     
     
       10. The micromechanical component as recited in  claim 9 , wherein a cap wafer is connected by seal-glass bonding to the sensor structures or to the monocrystalline or polycrystalline regions. 
     
     
       11. The micromechanical component as recited in  claim 9 , wherein the micromechanical component has at least one of a first insulating layer and a third insulating layer. 
     
     
       12. The micromechanical component as recited in  claim 9 , wherein the micromechanical component is planarized proceeding from a first side of the substrate material or from a second side of the substrate material. 
     
     
       13. The micromechanical component as recited in  claim 9 , wherein a cap wafer is connected via anodic bonding or seal-glass bonding to the spacing element or to monocrystalline or polycrystalline regions. 
     
     
       14. The micromechanical component as recited in  claim 13 , wherein the cap wafer encompasses a composite of a Pyrex® wafer and a silicon wafer. 
     
     
       15. The micromechanical component as recited in  claim 13 , wherein the cap water is made up of a Pyrex® wafer. 
     
     
       16. The micromechanical component as recited in  claim 13 , wherein the cap wafer is made up of a silicon wafer. 
     
     
       17. A method for producing a micromechanical component comprising:
 generating a trench structure in a substrate material proceeding from a first side, wherein the trench structure is substantially completely filled up by a first filler layer, 
 applying a first mask layer onto the first filler layer, 
 applying a second filler layer over the first mask layer, and 
 applying a second mask layer over the second filler layer, 
 wherein in an etching step, at least one of a further trench structure, a spacing element and sensor structures are formed, 
 wherein a cap wafer is connected by anodic bonding or seal-glass bonding to a spacing element or to monocrystalline or polycrystalline regions, or a cap wafer is connected by seal-glass bonding to the sensor structure or to the monocrystalline or polycrystalline regions, 
 wherein at least one of the cap wafer and a second side of the substrate material are planarized, the planarization of the second side of the substrate material being performed as far as a plane of the trench structure. 
 
     
     
       18. A micromechanical component produced according to a method comprising:
 generating a trench structure in a substrate material proceeding from a first side, wherein the trench structure is substantially completely filled up by a first filler layer, 
 applying a first mask layer onto the first filler layer, 
 applying a second filler layer over the first mask layer, and 
 applying a second mask layer over the second filler layer, 
 wherein in an etching step, at least one of a further trench structure, a spacing element and sensor structures are formed, 
 wherein movable sensor structures are formed at least in part from the sensor structures by way of a further etching step, the movable sensor structures in the micromechanical component being formed from the first filler layer, 
 wherein the trench structure is filled up substantially completely by the first filler layer, the first filler layer constituting the movable sensor structures and the sensor structures, 
 wherein the micromechanical component is planarized from a second side of the substrate material as far as a plane of the trench structure.