Inventor

SEDDON MICHAEL J

US164 patents

⚠️ This page may combine multiple inventors who share the name “SEDDON MICHAEL J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEDDON MICHAEL J

SEMICONDUCTOR COMPONENTS IND LLC

Semiconductor wafer thinning systems and related methods

Semiconductor device and method of forming micro interconnect structures

Backside metal patterning die singulation systems and related methods

SOI substrate and related methods

Backside metal patterning die singulation system and related methods

Jet ablation die singulation systems and related methods

Current sensor packages with through hole in semiconductor

Semiconductor substrate production systems and related methods

Semiconductor device and method of aligning semiconductor wafers for bonding

Method for removing material from a substrate using in-situ thickness measurement

Semiconductor device and method of aligning semiconductor wafers for bonding

Flip chip bonding alloys

Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel

Semiconductor die singulation method

Semiconductor wafer and method of probe testing

Semiconductor wafer and method of backside probe testing through opening in film frame

Curved semiconductor die systems and related methods

Semiconductor device and method of forming micro interconnect structures

Through-substrate via structure and method of manufacture

Backside metal patterning die singulation systems and related methods

Backside metal patterning die singulation system and related methods

Jet ablation die singulation systems and related methods

Semiconductor device and method of forming micro interconnect structures

Through-substrate via structure and method of manufacture

Backside metal patterning die singulation system and related methods

Multichip module supports and related methods

Semiconductor packages with die including cavities and related methods

Semiconductor wafer and method of probe testing

Semiconductor wafer and method of ball drop on thin wafer with edge support ring

Semiconductor packages with an intermetallic layer

Jet ablation die singulation systems and related methods

Through-substrate via structure and method of manufacture

Semiconductor device and method of forming cantilevered protrusion on a semiconductor die

Backside metal photolithographic patterning die singulation systems and related methods

Backside metal patterning die singulation systems and related methods

Methods of aligning a semiconductor wafer for singulation

SEMICONDUCTOR COMPONENTS IND

Electronic component and method of manufacture

Semiconductor die singulation method

Semiconductor die singulation method

Flexible substrate for packaging a semiconductor component

Method of forming a semiconductor die

Encapsulated electronic device structure

Semiconductor device package

Semiconductor device package

Semiconductor die singulation method

Semiconductor package structure having enhanced thermal dissipation characteristics

SEDDON MICHAEL J

Thinned semiconductor wafer and method of thinning a semiconductor wafer

Method of thinning a semiconductor wafer using a film frame

BURGHOUT WILLIAM F

Semiconductor die singulation method

GRIVNA GORDON M

Method of forming a semiconductor die