Inventor

CONG HAI

SG27 patents

⚠️ This page may combine multiple inventors who share the name “CONG HAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CONG HAI

GLOBALFOUNDRIES SG PTE LTD

Integrated magnetic random access memory with logic device having low-k interconnects

Integrated circuit system employing sacrificial spacers

Integrated two-terminal device with logic device for embedded application

Integrated magnetic random access memory with logic device having low-K interconnects

Integrated two-terminal device with logic device for embedded application

Reliable interconnect for semiconductor device

CD control

Dual encapsulation integration scheme for fabricating integrated circuits with magnetic random access memory structures

CD control

Etch bias control

Method for forming through silicon via with wafer backside protection

Metal-insulator-metal capacitor with improved time-dependent dielectric breakdown

TSV without zero alignment marks

Method of forming a via contact

Methods for removal of hard mask

CHARTERED SEMICONDUCTOR MFG

Method to control dual damascene trench etch profile and trench depth uniformity

Thin film etching method and semiconductor device fabrication using same

Method for reducing silicide defects in integrated circuits

Method for reducing silicide defects in integrated circuits

LIU JINPING

Integrated circuit and method of fabrication thereof

Integrated circuit and method of fabrication thereof

CONG HAI

Critical dimension for trench and vias

Processing with reduced line end shortening ratio

RAO XUESONG

Step-like spacer profile

Spacer profile engineering using films with continuously increased etch rate from inner to outer surface

LIU HUANG

Integration of eNVM, RMG, and HKMG modules

LEONG LUP SAN

Method for forming through silicon via with wafer backside protection