P

Inventor

CHENG TAO

CN105 patents
⚠️ This page may combine multiple inventors who share the name “CHENG TAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MEDIATEK INC

16 patents
US7897995B2Mar 1, 2011

Lateral bipolar junction transistor with reduced base resistance

MEDIATEK INC21 citations92
US7667302B1Feb 23, 2010

Integrated circuit chip with seal ring structure

MEDIATEK INC23 citations92
US7821038B2Oct 26, 2010

Power and ground routing of integrated circuit devices with improved IR drop and chip performance

MEDIATEK INC18 citations90
US9761534B2Sep 12, 2017

Semiconductor package, semiconductor device using the same and manufacturing method thereof

MEDIATEK INC11 citations84
US9597752B2Mar 21, 2017

Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereof

MEDIATEK INC7 citations84
US7671469B2Mar 2, 2010

SiGe device with SiGe-embedded dummy pattern for alleviating micro-loading effect

MEDIATEK INC16 citations82
US7532446B2May 12, 2009

Protection circuit for electro static discharge

MEDIATEK INC11 citations82
US10354974B2Jul 16, 2019

Structure and formation method of chip package structure

MEDIATEK INC2 citations73
US9908203B2Mar 6, 2018

Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereof

MEDIATEK INC4 citations73
US9881902B2Jan 30, 2018

Semiconductor package, semiconductor device using the same and manufacturing method thereof

MEDIATEK INC2 citations73
US11373957B2Jun 28, 2022

Semiconductor package with layer structures, antenna layer and electronic component

MEDIATEK INC2 citations72
US10784206B2Sep 22, 2020

Semiconductor package

MEDIATEK INC2 citations72
US7203050B2Apr 10, 2007

NPN Darlington ESD protection circuit

MEDIATEK INC8 citations72
US9905515B2Feb 27, 2018

Integrated circuit stress releasing structure

MEDIATEK INC3 citations71
US9698102B2Jul 4, 2017

Power and ground routing of integrated circuit devices with improved IR drop and chip performance

MEDIATEK INC3 citations71
US7491584B2Feb 17, 2009

ESD protection device in high voltage and manufacturing method for the same

MEDIATEK INC6 citations71

TAIWAN SEMICONDUCTOR MFG

8 patents

SYMANTEC CORP

6 patents

CHENG TAO

4 patents

MATHWORKS INC

3 patents

POPIN INC

2 patents

CHANG TIEN-CHANG

2 patents

CA INC

2 patents

SHANGHAI XSTAR TECH CO LTD

2 patents

WINBOND ELECTRONICS CORP

1 patent

WANG CHI

1 patent

KO CHING-CHUNG

1 patent

CHANG KEVIN CHEN-CHUAN

1 patent

3M INNOVATIVE PROPERTIES CO

1 patent

Showing the top 50 of 105 patents by PatentIndex Score.