Inventor · disambiguated record
Tien-Shan Hsu
Also filed as: HSU TIEN-SHAN
8 granted patents·1 pending application·40 citations·filing 2017–2023
80Inventor score
Files withUNITED MICROELECTRONICS CORP9
Top patents by PatentIndex Score
9 records- 0196US10109531B1Semiconductor structure having a bump lower than a substrate base and a width of the bump larger than a width of fin shaped structures, and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Oct 23, 2018·31 cites·20 claims
- 0293US10283415B2Semiconductor structure with a bump having a width larger than a width of fin shaped structures and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 7, 2019·8 cites·20 claims
- 0369US10217866B2Semiconductor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 26, 2019·1 cites·11 claims
- 0464US11569235B2Semiconductor device and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jan 31, 2023·0 cites·9 claims
- 0557US10868011B2Semiconductor device and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Dec 15, 2020·0 cites·9 claims
- 0657US10446682B2Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 15, 2019·0 cites·8 claims
- 0756US2025098238A1Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0849US10686079B1Fin field effect transistor structure with particular gate appearanceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jun 16, 2020·0 cites·14 claims
- 0943US10211107B1Method of fabricating fins including removing dummy fins after fluorocarbon flush step and oxygen clean stepUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 19, 2019·0 cites·6 claims
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