Inventor
LIN PU-JU
TW42 patents
⚠️ This page may combine multiple inventors who share the name “LIN PU-JU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNIMICRON TECHNOLOGY CORP
41 patentsUS11410971B2Aug 9, 2022
Chip package structure
UNIMICRON TECHNOLOGY CORP2 citations73
US10685922B2Jun 16, 2020
Package structure with structure reinforcing element and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP2 citations73
US11516910B1Nov 29, 2022
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP4 citations72
US11460255B2Oct 4, 2022
Vapor chamber device and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP2 citations67
US12243838B2Mar 4, 2025
Circuit substrate structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations62
US11943877B2Mar 26, 2024
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP1 citations62
US11690180B2Jun 27, 2023
Manufacturing method of carrier structure
UNIMICRON TECHNOLOGY CORP0 citations62
US11637047B2Apr 25, 2023
Manufacturing method of chip package structure
UNIMICRON TECHNOLOGY CORP0 citations62
US11462452B2Oct 4, 2022
Chip package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations62
US11424216B2Aug 23, 2022
Electronic device bonding structure and fabrication method thereof
UNIMICRON TECHNOLOGY CORP0 citations62
US11410940B2Aug 9, 2022
Package structure with structure reinforcing element and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations62
US10957658B2Mar 23, 2021
Package structure with structure reinforcing element and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations62
US10925172B1Feb 16, 2021
Carrier structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations62
US12525522B2Jan 13, 2026
Package structure and method for manufacturing the same
UNIMICRON TECHNOLOGY CORP0 citations61
US12504591B2Dec 23, 2025
Co-packaged structure for optics and electrics
UNIMICRON TECHNOLOGY CORP0 citations61
US12568810B2Mar 3, 2026
Anti-diffusion substrate structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations60
US12563667B2Feb 24, 2026
Manufacturing method of circuit board structure
UNIMICRON TECHNOLOGY CORP0 citations60
US12250776B2Mar 11, 2025
Substrate structure and cutting method thereof
UNIMICRON TECHNOLOGY CORP0 citations60
US12185479B2Dec 31, 2024
Flexible circuit board and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations60
US11991824B2May 21, 2024
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations60
US12525542B2Jan 13, 2026
Package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations59
US11366381B2Jun 21, 2022
Mask structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations58
US12062742B2Aug 13, 2024
Package structure and manufacturing method of the same
UNIMICRON TECHNOLOGY CORP0 citations56
US11488900B2Nov 1, 2022
Wiring board with interposer substrate surrounded by underfill and embedded in main substrate and method of fabricating the same
UNIMICRON TECHNOLOGY CORP0 citations56
US12218017B2Feb 4, 2025
Glass carrier having protection structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations52
US11410933B2Aug 9, 2022
Package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations52
US11362057B2Jun 14, 2022
Chip package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations52
US10588214B2Mar 10, 2020
Stacked structure and method for manufacturing the same
UNIMICRON TECHNOLOGY CORP0 citations52
US11764344B2Sep 19, 2023
Package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations51
US11476234B2Oct 18, 2022
Chip package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations51
US12160953B2Dec 3, 2024
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US11710690B2Jul 25, 2023
Package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US11682612B2Jun 20, 2023
Package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US11665832B2May 30, 2023
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US11166387B2Nov 2, 2021
Wiring board and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US10950535B2Mar 16, 2021
Package structure and method of manufacturing the same
UNIMICRON TECHNOLOGY CORP0 citations50
US11955587B2Apr 9, 2024
Light emitting diode package structure and manufacturing method thereof and manufacturing method of display device
UNIMICRON TECHNOLOGY CORP0 citations49
US11764120B2Sep 19, 2023
Chip packaging structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations49
US12438060B2Oct 7, 2025
Chip package and method of manufacturing the same
UNIMICRON TECHNOLOGY CORP0 citations47
US12369250B2Jul 22, 2025
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations47
US10324370B2Jun 18, 2019
Manufacturing method of circuit substrate and mask structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations47