Inventor · disambiguated record
Cecilia Martner
Also filed as: MARTNER CECILIA · MARTNER CECILIA C
3 granted patents·1 pending application·30 citations·filing 2003–2008
71Inventor score
Files withAPPLIED MATERIALS INC4
Top patents by PatentIndex Score
4 records- 0179US7355394B2Apparatus and method of dynamically measuring thickness of a layer of a substrateAPPLIED MATERIALS INC·Filed 2006·Granted Apr 8, 2008·9 cites·17 claims
- 0278US7112961B2Method and apparatus for dynamically measuring the thickness of an objectAPPLIED MATERIALS INC·Filed 2003·Granted Sep 26, 2006·18 cites·45 claims
- 0363US7777483B2Method and apparatus for measuring a thickness of a layer of a waferAPPLIED MATERIALS INC·Filed 2008·Granted Aug 17, 2010·3 cites·19 claims
- 0438US2006076511A1Shallow angle cut along a longitudinal direction of a feature in a semiconductor waferAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
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