Inventor
LI DONGQING
US27 patents
⚠️ This page may combine multiple inventors who share the name “LI DONGQING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
18 patentsUS6903031B2Jun 7, 2005
In-situ-etch-assisted HDP deposition using SiF4 and hydrogen
APPLIED MATERIALS INC111 citations99
US7081414B2Jul 25, 2006
Deposition-selective etch-deposition process for dielectric film gapfill
APPLIED MATERIALS INC98 citations98
US6929700B2Aug 16, 2005
Hydrogen assisted undoped silicon oxide deposition process for HDP-CVD
APPLIED MATERIALS INC482 citations98
US6596653B2Jul 22, 2003
Hydrogen assisted undoped silicon oxide deposition process for HDP-CVD
APPLIED MATERIALS INC542 citations98
US6908862B2Jun 21, 2005
HDP-CVD dep/etch/dep process for improved deposition into high aspect ratio features
APPLIED MATERIALS INC277 citations97
US6740601B2May 25, 2004
HDP-CVD deposition process for filling high aspect ratio gaps
APPLIED MATERIALS INC53 citations96
US7465680B2Dec 16, 2008
Post deposition plasma treatment to increase tensile stress of HDP-CVD SIO2
APPLIED MATERIALS INC28 citations92
US6682603B2Jan 27, 2004
Substrate support with extended radio frequency electrode upper surface
APPLIED MATERIALS INC21 citations90
US10428426B2Oct 1, 2019
Method and apparatus to prevent deposition rate/thickness drift, reduce particle defects and increase remote plasma system lifetime
APPLIED MATERIALS INC9 citations83
US7294588B2Nov 13, 2007
In-situ-etch-assisted HDP deposition
APPLIED MATERIALS INC5 citations74
US7049211B2May 23, 2006
In-situ-etch-assisted HDP deposition using SiF4
APPLIED MATERIALS INC6 citations74
US7196021B2Mar 27, 2007
HDP-CVD deposition process for filling high aspect ratio gaps
APPLIED MATERIALS INC5 citations73
US6914016B2Jul 5, 2005
HDP-CVD deposition process for filling high aspect ratio gaps
APPLIED MATERIALS INC8 citations73
US7799698B2Sep 21, 2010
Deposition-selective etch-deposition process for dielectric film gapfill
APPLIED MATERIALS INC4 citations63
US7691753B2Apr 6, 2010
Deposition-selective etch-deposition process for dielectric film gapfill
APPLIED MATERIALS INC3 citations63
US11469100B2Oct 11, 2022
Methods of post treating dielectric films with microwave radiation
APPLIED MATERIALS INC0 citations62
US7745351B2Jun 29, 2010
Post deposition plasma treatment to increase tensile stress of HDP-CVD SIO2
APPLIED MATERIALS INC4 citations62
US10934620B2Mar 2, 2021
Integration of dual remote plasmas sources for flowable CVD
APPLIED MATERIALS INC0 citations51