Inventor

HOULE SABINA J

US38 patents

⚠️ This page may combine multiple inventors who share the name “HOULE SABINA J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HOULE SABINA J

INTEL CORP

Composite thermal interface devices and methods for integrated circuit heat transfer

Method to compensate for stress between heat spreader and thermal interface material

Electronic assembly having a wetting layer on a thermally conductive heat spreader

Carbon-carbon and/or metal-carbon fiber composite heat spreaders

Carbon-carbon and/or metal-carbon fiber composite heat spreader

Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly

Heat dissipating device with preselected designed interface for thermal interface materials

Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly

Liquid solder thermal interface material contained within a cold-formed barrier and methods of making same

Carbon-carbon and/or metal-carbon fiber composite heat spreaders

Thermal heat spreaders designed for lower cost manufacturability, lower mass and increased thermal performance

Thermal interface structure with integrated liquid cooling and methods

Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same

Apparatus and method for containing excess thermal interface material

Method of forming heat spreader with down set leg attachment feature

Integrated heat spreader with downset edge, and method of making same

Integrated heat spreader package for heat transfer and for bond line thickness control and process of making

Heat sink with preattached thermal interface material and method of making same

Thermal interface structure with integrated liquid cooling and methods

Injection molded metal bonding tray for integrated circuit device fabrication

Package and method for attaching an integrated heat spreader

Apparatus to compensate for stress between heat spreader and thermal interface material

Thermal interface structure with integrated liquid cooling and methods

Carbon-carbon and/or metal-carbon fiber composite heat spreader

Heat sink with preattached thermal interface material and method of making same

Heat spreader with down set leg attachment feature

Heat dissipating device with preselected designed interface for thermal interface materials

Flux overspray removal masks with channels, methods of assembling same, and systems containing same

Underfill process and materials for singulated heat spreader stiffener for thin core panel processing

Injection molded metal stiffener for packaging applications

Method of bonding a microelectronic die to a substrate and arrangement to carry out method

HOULE SABINA J

Underfill process and materials for singulated heat spreader stiffener for thin core panel processing

Underfill process and materials for singulated heat spreader stiffener for thin core panel processing

Method of making microelectronic package using integrated heat spreader stiffener panel and microelectronic package formed according to the method

RAMANAN HARIKRISHNAN

Rotational-flow spray nozzle and process of using same

Rotational-flow spray nozzle and process of using same

DONNELLY CORP

Vehicle panel assembly

WILLIAMS JOEL

Compliant spray flux masks, systems, and methods