Injection molded metal bonding tray for integrated circuit device fabrication

Abstract

An injection molded metal bonding tray may be utilized in the fabrication of integrated circuit devices. In one embodiment, a substrate of an integrated circuit device is placed in a pocket of an injection molded metal bonding tray. A plurality of conductors is placed on the substrate and the conductors are bonded to the substrate in an infrared reflow oven, for example. Other embodiments are described and claimed.

1. A fabrication tool for use in fabricating an integrated circuit device having a substrate, comprising:
 an injection molded metal bonding tray having an oxide material coating said bonding tray, said bonding tray being adapted to support said substrate in an oven. 
 
   
   
     2. The fabrication tool of  claim 1  wherein said metal is a magnesium-aluminum alloy. 
   
   
     3. The fabrication tool of  claim 1  wherein said bonding tray is injection molded using a thixotropic metal alloy. 
   
   
     4. The fabrication tool of  claim 1  wherein said bonding tray has a glass transition temperature in excess of 265 degrees C. 
   
   
     5. The fabrication tool of  claim 4  wherein said bonding tray has a glass transition temperature in excess of 450 degrees C. 
   
   
     6. The fabrication tool of  claim 1  wherein said bonding tray has a total surface resistivity of 10 5 –10 9  ohms. 
   
   
     7. The fabrication tool of  claim 1  wherein said bonding tray has a flexural modulus in excess of 11 GPa. 
   
   
     8. The fabrication tool of  claim 1  wherein said bonding tray has a plurality of pockets, each pocket being adapted to receive and position a substrate within said tray. 
   
   
     9. A system, comprising:
 a reflow oven adapted to heat an integrated circuit device having a substrate; and 
 an injection molded metal bonding tray having an oxide material coating said bonding tray, said bonding tray being adapted to support said substrate in said oven. 
 
   
   
     10. The system of  claim 9  wherein said metal is a magnesium-aluminum alloy. 
   
   
     11. The system of  claim 9  wherein said bonding tray is injection molded using a thixotropic metal alloy. 
   
   
     12. The system of  claim 9  wherein said bonding tray has a glass transition temperature in excess of 265 degrees C. 
   
   
     13. The system of  claim 12  wherein said bonding tray has a glass transition temperature in excess of 450 degrees C.