Inventor
DAVISON PETER A
21 patents
⚠️ This page may combine multiple inventors who share the name “DAVISON PETER A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
17 patentsUS6859367B2Feb 22, 2005
Heat sink attachment device
INTEL CORP67 citations98
US6809928B2Oct 26, 2004
Sealed and pressurized liquid cooling system for microprocessor
INTEL CORP59 citations96
US6208514B1Mar 27, 2001
Mechanical latch for an electronic cartridge
INTEL CORP51 citations95
US6515871B1Feb 4, 2003
Protection shield for an electronic cartridge
INTEL CORP22 citations92
US6030251AFeb 29, 2000
Keyed interlock and mechanical alignment integrated mechanical retention features for PC system
INTEL CORP33 citations92
US5973399AOct 26, 1999
Tamper resistant attach mechanism between plastic cover and thermal plate assembly for processor cartridges
INTEL CORP25 citations92
US6496372B1Dec 17, 2002
Heat sink fastener for an electronic device
INTEL CORP35 citations90
US6709277B2Mar 23, 2004
System and method for connecting a power converter to a land grid array socket
INTEL CORP34 citations89
US7183140B2Feb 27, 2007
Injection molded metal bonding tray for integrated circuit device fabrication
INTEL CORP16 citations84
US9305816B2Apr 5, 2016
Methods and devices for securing and transporting singulated die in high volume manufacturing
INTEL CORP5 citations80
US7285447B2Oct 23, 2007
Method and apparatus for imprinting a circuit pattern using ultrasonic vibrations
INTEL CORP7 citations74
US6524116B2Feb 25, 2003
Interlocking socket base for an integrated circuit package
INTEL CORP5 citations74
US6264478B1Jul 24, 2001
Interlocking socket base for an integrated circuit package
INTEL CORP8 citations74
US6884086B1Apr 26, 2005
System and method for connecting a power converter to a land grid array socket
INTEL CORP9 citations71
US6327147B1Dec 4, 2001
Retention mechanism and electronic module mounting system
INTEL CORP14 citations68
US7674729B2Mar 9, 2010
Method and apparatus for imprinting a circuit pattern using ultrasonic vibrations
INTEL CORP3 citations63
US6560118B2May 6, 2003
Injection mold gate concealment by integrating surface recess and cosmetic label attachment
INTEL CORP0 citations47