Inventor · disambiguated record
Tsung-Hsi Ko
Also filed as: KO TSUNG-HSI
2 granted patents·8 citations·filing 2007–2009
47Inventor score
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2 records- 0173US8546739B2Manufacturing method of wafer level chip scale package of image-sensing moduleHSUAN MIN-CHIH·Filed 2009·Granted Oct 1, 2013·8 cites·15 claims
- 0249US7659501B2Image-sensing module of image capture apparatus and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2007·Granted Feb 9, 2010·0 cites·35 claims
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