Inventor
ICHIKAWA ISAO
JP21 patents
⚠️ This page may combine multiple inventors who share the name “ICHIKAWA ISAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LINTEC CORP
16 patentsUS9296925B2Mar 29, 2016
Film-like adhesive, adhesive sheet for semiconductor junction, and method for producing semiconductor device
LINTEC CORP3 citations71
US9382455B2Jul 5, 2016
Adhesive composition, an adhesive sheet and a production method of a semiconductor device
LINTEC CORP4 citations68
US12288768B2Apr 29, 2025
Method of manufacturing laminate
LINTEC CORP0 citations61
US11948865B2Apr 2, 2024
Film-shaped firing material and film-shaped firing material with a support sheet
LINTEC CORP0 citations61
US11707787B2Jul 25, 2023
Film-shaped firing material, film-shaped firing material provided with support sheet, method for manufacturing film-shaped firing material, and method for manufacturing film-shaped firing material provided with support sheet
LINTEC CORP0 citations61
US11267992B2Mar 8, 2022
Film-shaped firing material and film-shaped firing material with support sheet
LINTEC CORP0 citations61
US7842551B2Nov 30, 2010
Adhesive composition, adhesive sheet and production process for semiconductor device
LINTEC CORP4 citations60
US7674859B2Mar 9, 2010
Adhesive composition and adhesive sheet
LINTEC CORP6 citations60
US9434865B2Sep 6, 2016
Adhesive composition, an adhesive sheet and a production method of a semiconductor device
LINTEC CORP2 citations57
US12406960B2Sep 2, 2025
Method of manufacturing laminate by sinter- bonding semiconductor chip and substrate
LINTEC CORP0 citations51
US11420255B2Aug 23, 2022
Film-shaped firing material and film-shaped firing material with a support sheet
LINTEC CORP0 citations50
US11285536B2Mar 29, 2022
Film-shaped fired material, and film-shaped fired material with support sheet
LINTEC CORP0 citations50
US9562179B2Feb 7, 2017
Adhesive composition, adhesive sheet and production process for semiconductor device
LINTEC CORP0 citations50
US7851335B2Dec 14, 2010
Adhesive composition, adhesive sheet and production method of semiconductor device
LINTEC CORP1 citations49
US10131824B2Nov 20, 2018
Adhesive composition, adhesive sheet, and method for producing semiconductor device
LINTEC CORP0 citations47
US11219946B2Jan 11, 2022
Firing material composition, method for manufacturing film-shaped firing material, and method for manufacturing film-shaped firing material with support sheet
LINTEC CORP0 citations46