Inventor · disambiguated record
Jen-Hau Cheng
Also filed as: CHENG JEN-HAU
9 granted patents·4 pending applications·105 citations·filing 2004–2019
89Inventor score
Files withKELVIN THERMAL TECH INC5ARNEY SUSANNE2IND TECH RES INST2ALCATEL LUCENT USA INC1LIU CHUN-KAI1
Top patents by PatentIndex Score
13 records- 0196US10571200B2Thermal ground planeKELVIN THERMAL TECH INC·Filed 2017·Granted Feb 25, 2020·10 cites·23 claims
- 0296US9909814B2Flexible thermal ground plane and manufacturing the sameKELVIN THERMAL TECH INC·Filed 2015·Granted Mar 6, 2018·20 cites·27 claims
- 0396US9651312B2Flexible thermal ground plane and manufacturing the sameKELVIN THERMAL TECH INC·Filed 2015·Granted May 16, 2017·24 cites·18 claims
- 0494US10527358B2Thermal ground planeKELVIN THERMAL TECH INC·Filed 2016·Granted Jan 7, 2020·10 cites·20 claims
- 0593US9163883B2Flexible thermal ground plane and manufacturing the sameYANG RONGGUI·Filed 2010·Granted Oct 20, 2015·22 cites·27 claims
- 0681US8542489B2Mechanically-reattachable liquid-cooled cooling apparatusARNEY SUSANNE·Filed 2011·Granted Sep 24, 2013·7 cites·20 claims
- 0769US7550289B2Method of fabricating an entegral device of a biochip intergrated with micro thermo-electric elements and the apparatus thereofIND TECH RES INST·Filed 2005·Granted Jun 23, 2009·2 cites·11 claims
- 0865US8426720B2Micro thermoelectric device and manufacturing method thereofLIU CHUN-KAI·Filed 2004·Granted Apr 23, 2013·10 cites·13 claims
- 0964US11353269B2Thermal ground planeKELVIN THERMAL TECH INC·Filed 2019·Granted Jun 7, 2022·0 cites·19 claims
- 1048US2014209288A1Cooling techniqueALCATEL LUCENT USA INC·Filed 2013·Application pending·0 cites
- 1140US2006156737A1Cooling structure of solid state and formation thereof with integrated packageIND TECH RES INST·Filed 2005·Application pending·0 cites
- 1240US2007012938A1Light-emitting-diode packaging structure having thermal-electric elementYU CHIH-KUANG·Filed 2005·Application pending·0 cites
- 1339US2012279683A1Cooling apparatus for communications platformsARNEY SUSANNE·Filed 2011·Application pending·0 cites
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