Cooling structure of solid state and formation thereof with integrated package

Abstract

A cooling structure of solid state applied to a heat source has a module of thermoelectric transfer and a module of thermo transfer including two structures of passive cooling connected and attached the module of thermoelectric transfer, respectively. One structure of first structure of passive cooling is near heat source and heat generated by the heat source is transferred to another structure of passive cooling through the one structure passive cooling and the module of thermoelectric transfer when electrical power is employed to the module of thermoelectric transfer.

1 . A cooling structure of solid state, applied to a heat source, said cooling structure of solid state comprising: 
 a module of thermoelectric transfer; and    a module of thermal transfer including a first structure of passive cooling and a second structure of passive cooling connected and attached said module of thermoelectric transfer, respectively, said first structure of passive cooling near said heat source;    wherein heat generated by said heat source is transferred to said second structure of passive cooling through said first structure of passive cooling and said module of thermoelectric transfer when electric power is employed to said module of thermoelectric transfer.    
   
   
       2 . The cooling structure of solid state according to  claim 1 , wherein said module of thermoelectric transfer comprises a plurality of thermoelectric elements and conductive junctions, a portion of said conductive junctions configured for connecting any two said thermoelectric elements neighboring each other and said heat source.  
   
   
       3 . The cooling structure of solid state according to  claim 2 , wherein said plurality of thermoelectric elements are made of N-type and P-type semiconductor materials.  
   
   
       4 . The cooling structure of solid state according to  claim 1 , wherein said first structure of passive cooling comprises a part of thermal conduction and a part of electro insulation between said module of thermoelectric transfer and said part of thermal conduction.  
   
   
       5 . The cooling structure of solid state according to  claim 4 , wherein said part of electro insulation is implemented by electroplating, coating, sputtering or sintering. a ceramic material, oxide layer or electrical insulator.  
   
   
       6 . The cooling structure of solid state according to  claim 1 , wherein said second structure of passive cooling comprises a part of thermal conduction and a part of electrical insulation between said module of thermoelectric transfer and said part of thermal conduction.  
   
   
       7 . The cooling structure of solid state according to  claim 6 , wherein said part of electro insulation is implemented by electro-plating, coating, sputtering or sintering a ceramic material, oxide layer or electrical insulator.  
   
   
       8 . A package system of integrating package and cooling structure, comprising: 
 a package module including a heat source;    a module of thermoelectric transfer; and    a module of thermal transfer including a first structure of passive cooling and a second structure of passive cooling connected and attached said module of thermoelectric transfer, respectively, said first structure of passive cooling near said heat source;    wherein heat generated by said heat source is transferred to said second structure of passive cooling through said first structure of passive cooling and said module of thermoelectric transfer when electrical power is employed to said module of thermoelectric transfer.    
   
   
       9 . The package system of integrating package and cooling structure according to  claim 8 , wherein said package module further comprises an electric circuit board, a plurality of conductive junctions and a molding compound, said heat source on a surface of said printed circuit board, said plurality of conductive junctions electrically connecting said electric circuit board and said heat source, and said molding compound on a portion of said surface, said heat source and said plurality of conductive junctions.  
   
   
       10 . The package system of integrating package and cooling structure according to  claim 8 , wherein said package module further comprises a lead-frame, a plurality of structures of conductive connection and a molding compound, said plurality of structure of conductive connection electrically connecting a plurality of inner leads of said lead-frame and said heat source, said molding compound encapsulating said plurality of inner leads, said heat source and said plurality of structures of conductive connection.  
   
   
       11 . The package system of integrating package and cooling structure according to  claim 8 , wherein said module of thermoelectric transfer comprises a plurality of thermoelectric elements and conductive junctions, a portion of said conductive junctions configured for connecting any two said thermoelectric elements neighboring each other and said heat source.  
   
   
       12 . The package system of integrating package and cooling structure according to  claim 8 , wherein said first structure of passive cooling is a metallic heat sink with a sintered surface near said module of thermoelectric transfer.  
   
   
       13 . The package system of integrating package and cooling structure according to  claim 8 , wherein said second structure of passive cooling comprises a part of thermal conduction and a part of electrical insulation between said module of thermoelectric transfer and said part of thermal conduction.  
   
   
       14 . The package system of integrating package and cooling structure according to  claim 8 , wherein said second structure of passive cooling comprises a metallic substrate, said metallic substrate with a sintered surface near said module of thermoelectric transfer on one side and a plurality of metallic heat fins on the other side.  
   
   
       15 . A method of forming cooling structure of solid state, comprising: 
 providing a first structure of passive cooling and a plurality of first adhesion structure on a first surface of said first structure of passive cooling;    positioning a plurality of structure of thermoelectric transfer on said first surface, wherein each of said structures of thermoelectric transfer is associated with each of said first adhesion structures;    providing a second structure of passive cooling and a plurality of second adhesion structure on a second surface of said second structure of passive cooling; and    attaching each of said structures of thermoelectric transfer to each of said second adhesion structures.    
   
   
       16 . The method of forming cooling structure of solid state according to  claim 15 , wherein the step of providing said first structure of passive cooling comprises: 
 providing a thermal conductive substrate providing said first surface;    forming a plurality of metallic structure positioned on said first surface; and    forming a conductive bump on each of said metallic structures, wherein each of said first adhesion structures comprises said conductive bump and said associated metallic structure.    
   
   
       17 . The method of forming cooling structure of solid state according to  claim 16 , wherein the step of forming said conductive bump is implemented by printing.  
   
   
       18 . The method of forming cooling structure of solid state according to  claim 15 , wherein the step of positioning comprises: 
 forming a plurality of first conductive junctions on said first surface;    forming a plurality of thermoelectric elements on said plurality of first conductive junctions; and    forming a plurality of second conductive junctions on said plurality of thermoelectric elements, wherein any two said thermoelectric elements neighboring each other connect through one of any said first conductive junction and any said second conductive junction.    
   
   
       19 . The method of forming cooling structure of solid state according to  claim 15 , wherein the step of said second structure of passive cooling comprises: 
 providing a thermal conductive substrate providing said second surface;    forming a plurality of metallic structure positioned on said second surface; and    forming a conductive bump on each of said metallic structures, wherein each of said second adhesion structures comprises said conductive bump and said associated metallic structure.    
   
   
       20 . The method of forming cooling structure of solid state according to  claim 19 , further comprising sintering said second surface.