Inventor · disambiguated record
Chun-Kai Liu
Also filed as: LIU CHUN · LIU CHUN-KAI
37 granted patents·13 pending applications·292 citations·filing 2002–2024
97Inventor score
Top patents by PatentIndex Score
50 records- 0196US7633154B2Encapsulation and methods thereofIND TECH RES INST·Filed 2006·Granted Dec 15, 2009·53 cites·12 claims
- 0294US8075182B2Apparatus and method for measuring characteristic and chip temperature of LEDDAI MING-JI·Filed 2008·Granted Dec 13, 2011·64 cites·22 claims
- 0391US7586125B2Light emitting diode package structure and fabricating method thereofIND TECH RES INST·Filed 2006·Granted Sep 8, 2009·21 cites·17 claims
- 0490US7999172B2Flexible thermoelectric deviceIND TECH RES INST·Filed 2007·Granted Aug 16, 2011·13 cites·18 claims
- 0589US10051742B2Power module and manufacturing method thereofIND TECH RES INST·Filed 2015·Granted Aug 14, 2018·7 cites·15 claims
- 0689US8609454B2Self-assembly apparatus, device self-assembling method, and method of assembling thermoelectric devicesDAI MING-JI·Filed 2012·Granted Dec 17, 2013·20 cites·22 claims
- 0787US9807914B2Power moduleIND TECH RES INST·Filed 2015·Granted Oct 31, 2017·5 cites·14 claims
- 0885US11362014B2Power moduleIND TECH RES INST·Filed 2020·Granted Jun 14, 2022·2 cites·18 claims
- 0983US8674491B2Semiconductor deviceLIU CHUN-KAI·Filed 2011·Granted Mar 18, 2014·7 cites·23 claims
- 1081US7952368B1Apparatus and method for measuring diode chipIND TECHNOLOGY RES INSTITURE·Filed 2010·Granted May 31, 2011·8 cites·10 claims
- 1181US6700783B1Three-dimensional stacked heat spreader assembly for electronic package and method for assemblingIND TECH RES INST·Filed 2003·Granted Mar 2, 2004·41 cites·17 claims
- 1280US9915184B2Waste heat exchangerIND TECH RES INST·Filed 2014·Granted Mar 13, 2018·2 cites·17 claims
- 1380US8193625B2Stacked-chip packaging structure and fabrication method thereofLIU CHUN-KAI·Filed 2009·Granted Jun 5, 2012·9 cites·9 claims
- 1472US9418921B2Power moduleIND TECH RES INST·Filed 2015·Granted Aug 16, 2016·2 cites·20 claims
- 1572US8008573B2Integrated package structure having solar cell and thermoelectric element and method of fabricating the sameIND TECH RES INST·Filed 2007·Granted Aug 30, 2011·2 cites·14 claims
- 1671US8546924B2Package structures for integrating thermoelectric components with stacking chipsYU CHIH-KUANG·Filed 2010·Granted Oct 1, 2013·3 cites·16 claims
- 1769US10288696B2Intelligent diagnosis system for power module and method thereofIND TECH RES INST·Filed 2016·Granted May 14, 2019·1 cites·18 claims
- 1869US7550289B2Method of fabricating an entegral device of a biochip intergrated with micro thermo-electric elements and the apparatus thereofIND TECH RES INST·Filed 2005·Granted Jun 23, 2009·2 cites·11 claims
- 1966US8310037B2Light emitting apparatus and fabrication method thereofLIU CHUN-KAI·Filed 2009·Granted Nov 13, 2012·2 cites·36 claims
- 2065US8664509B2Thermoelectric apparatus and method of fabricating the sameLIU CHUN-KAI·Filed 2011·Granted Mar 4, 2014·2 cites·17 claims
- 2165US8426720B2Micro thermoelectric device and manufacturing method thereofLIU CHUN-KAI·Filed 2004·Granted Apr 23, 2013·10 cites·13 claims
- 2262US7517114B2Lighting devicesIND TECH RES INST·Filed 2007·Granted Apr 14, 2009·3 cites·25 claims
- 2361US9029753B2Optical recognition system and method thereofNAT UNIV TSING HUA·Filed 2012·Granted May 12, 2015·1 cites·5 claims
- 2461US8242372B2Thermally conductive, electrically insulating composite film and stack chip package structure utilizing the sameLEU MING-SHENG·Filed 2010·Granted Aug 14, 2012·2 cites·20 claims
- 2560US7972877B2Fabricating method of light emitting diode packageIND TECH RES INST·Filed 2009·Granted Jul 5, 2011·1 cites·28 claims
- 2658US10818574B2Plug-in type power module and subsystem thereofIND TECH RES INST·Filed 2020·Granted Oct 27, 2020·0 cites·20 claims
- 2758US7855396B2Light emitting diode package structureIND TECH RES INST·Filed 2007·Granted Dec 21, 2010·1 cites·116 claims
- 2857US7004642B2Opto-electrical module packagingIND TECH RES INST·Filed 2003·Granted Feb 28, 2006·6 cites·18 claims
- 2956US2024243097A1Power module package structureIND TECH RES INST·Filed 2024·Application pending·0 cites
- 3055US9635302B2Active pixel sensor device and operating method of the sameELAN MICROELECTRONICS CORP·Filed 2015·Granted Apr 25, 2017·1 cites·20 claims
- 3154US2025210421A1Power module with detachable functionIND TECH RES INST·Filed 2024·Application pending·0 cites
- 3252US10492344B2Power moduleIND TECH RES INST·Filed 2017·Granted Nov 26, 2019·0 cites·11 claims
- 3352US2016163950A1Structure of thermoelectric module and fabricating method thereofIND TECH RES INST·Filed 2014·Application pending·0 cites
- 3450US2012227684A1Hydrogen/oxygen gas generating apparatus and internal combustion engine system having the sameTAIN RA-MIN·Filed 2012·Application pending·0 cites
- 3550US2024162114A1Power moduleIND TECH RES INST·Filed 2023·Application pending·0 cites
- 3649US2018040798A1Structure of thermoelectric module and fabricating method thereofIND TECH RES INST·Filed 2017·Application pending·0 cites
- 3748US8222728B2Active solid heatsink device and fabricating method thereofYU CHIH-KUANG·Filed 2008·Granted Jul 17, 2012·0 cites·29 claims
- 3848US2010163090A1Thermoelectric device and fabrication method thereof, chip stack structure, and chip package structureIND TECH RES INST·Filed 2009·Application pending·0 cites
- 3947US10707143B2Plug-in type power module and subsystem thereofIND TECH RES INST·Filed 2017·Granted Jul 7, 2020·0 cites·4 claims
- 4046US8963065B2Sensing device and method for operating sameLIU CHUN-KAI·Filed 2012·Granted Feb 24, 2015·0 cites·6 claims
- 4146US2014001086A1Retaining assembly for flat electronic deviceHON HAI PREC IND CO LTD·Filed 2013·Application pending·0 cites
- 4243US10118150B2Reactor and temperature control method thereofUNIV NAT TSING HUA·Filed 2016·Granted Nov 6, 2018·0 cites·12 claims
- 4343US6808323B2Passive alignment packaging structure for opto-electrical devices and optic fiber connectorsIND TECH RES INST·Filed 2003·Granted Oct 26, 2004·1 cites·16 claims
- 4442US2014138075A1Heat exchanger and semiconductor moduleIND TECH RES INST·Filed 2013·Application pending·0 cites
- 4542US2004086218A1Apparatus and method for optical signal processing systemASIA PACIFIC MICROSYSTEMS INC·Filed 2002·Application pending·0 cites
- 4640US2006156737A1Cooling structure of solid state and formation thereof with integrated packageIND TECH RES INST·Filed 2005·Application pending·0 cites
- 4740US2007012938A1Light-emitting-diode packaging structure having thermal-electric elementYU CHIH-KUANG·Filed 2005·Application pending·0 cites
- 4839US8188360B2Thermoelectric conversion deviceFENG SUH-YUN·Filed 2009·Granted May 29, 2012·0 cites·10 claims
- 4931USD1090465SPower module housingIND TECH RES INST·Filed 2024·Granted Aug 26, 2025·0 cites·1 claims
- 5031US2016050378A1Pixel sensor device and operating method thereofELAN MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →