Integrated package structure having solar cell and thermoelectric element and method of fabricating the same

Abstract

An integrated package structure having a solar cell and a thermoelectric element includes a substrate, a first solar cell and a thermoelectric element. The substrate has a first surface. The first solar cell has a second surface, a first electrode disposed on the second surface and a second electrode disposed on the second surface. The second surface faces the first surface. The thermoelectric element has a third electrode and a fourth electrode. The thermoelectric element is disposed between the first surface and the second surface. The first electrode and the second electrode are electrically connected to the third electrode and the fourth electrode respectively. A method of fabricating the integrated package structure having the solar cell and the thermoelectric element is also provided.

1. An integrated package structure having a solar cell and a thermoelectric element, comprising:
 a substrate, having a first surface; 
 a first solar cell, having a second surface, a first electrode disposed on the second surface and a second electrode disposed on the second surface, wherein the second surface faces the first surface; and 
 a thermoelectric element, having a third electrode and a fourth electrode, wherein the thermoelectric element is disposed between the first surface and the second surface, and the first electrode and the second electrode are in direct physical contact with and electrically connected to the third electrode and the fourth electrode respectively. 
 
     
     
       2. The integrated package structure as claimed in  claim 1 , wherein the thermoelectric element comprises:
 a first N-type semiconductor, electrically connected to the third electrode; 
 a first P-type semiconductor, electrically connected to the fourth electrode; and 
 a fifth electrode, electrically connected between the first N-type semiconductor and the first P-type semiconductor and disposed on the first surface. 
 
     
     
       3. The integrated package structure as claimed in  claim 2 , wherein the thermoelectric element further comprises:
 a sixth electrode, disposed on the first surface; 
 a seventh electrode, disposed on the second surface and located between the third electrode and the fourth electrode; 
 a second P-type semiconductor, wherein the fifth electrode is electrically connected between the first N-type semiconductor and the second P-type semiconductor; and 
 a second N-type semiconductor, wherein the seventh electrode is electrically connected between the second P-type semiconductor and the second N-type semiconductor, and the sixth electrode is electrically connected between the second N-type semiconductor and the first P-type semiconductor. 
 
     
     
       4. The integrated package structure as claimed in  claim 3 , wherein the substrate is a second solar cell having an eighth electrode disposed on the first surface and a ninth electrode disposed on the first surface, and the eighth electrode and the ninth electrode are electrically connected to the fifth electrode and the sixth electrode respectively. 
     
     
       5. The integrated package structure as claimed in  claim 1 , wherein the substrate is a heat-dissipating element comprising:
 a base, wherein the thermoelectric element is disposed on the base; and 
 a plurality of fins, disposed on a third surface of the base, wherein the third surface is far away from the thermoelectric element. 
 
     
     
       6. The integrated package structure as claimed in  claim 1 , further comprising a plurality of light-emitting elements disposed on a third surface of the substrate. 
     
     
       7. A method of fabricating an integrated package structure having a solar cell and a thermoelectric element, comprising:
 providing a substrate having a first surface; 
 providing a first solar cell having a second surface, a first electrode disposed on the second surface and a second electrode disposed on the second surface; and 
 forming a thermoelectric element between the first surface and the second surface so as to electrically connect a third electrode and a fourth electrode of the thermoelectric element to the first electrode and the second electrode of the first solar cell respectively, wherein the second surface faces the first surface, and the first electrode and the second electrode are in direct physical contact with the third electrode and the fourth electrode respectively. 
 
     
     
       8. The method as claimed in  claim 7 , wherein the step of forming the thermoelectric element between the first surface and the second surface comprises:
 forming a first patterned electrode layer on the second surface, wherein the first patterned electrode layer has the third electrode and the fourth electrode, and the third electrode and the fourth electrode are electrically connected to the first electrode and the second electrode respectively; 
 forming a second patterned electrode layer on the first surface, wherein the second patterned electrode layer has a fifth electrode; 
 forming a first N-type semiconductor and a first P-type semiconductor; and 
 assembling the first solar cell and the substrate so that the first N-type semiconductor is electrically connected between the third electrode and the fifth electrode, and the first P-type semiconductor is electrically connected between the fourth electrode and the fifth electrode. 
 
     
     
       9. The method as claimed in  claim 8 , wherein the first N-type semiconductor and the first P-type semiconductor are formed on the fifth electrode. 
     
     
       10. The method as claimed in  claim 8 , wherein the first N-type semiconductor and the first P-type semiconductor are formed on the third electrode and the fourth electrode respectively. 
     
     
       11. The method as claimed in  claim 8 , wherein the second patterned electrode layer further has a sixth electrode, and the first patterned electrode layer further has a seventh electrode located between the third electrode and the fourth electrode; before the first solar cell and the substrate are assembled, the method further comprises forming a second P-type semiconductor and a second N-type semiconductor; when the first solar cell and the substrate are assembled, the first N-type semiconductor is electrically connected between the third electrode and the fifth electrode, the second P-type semiconductor is electrically connected between the fifth electrode and the seventh electrode, the second N-type semiconductor is electrically connected between the seventh electrode and the sixth electrode, and the first P-type semiconductor is electrically connected between the sixth electrode and the fourth electrode. 
     
     
       12. The method as claimed in  claim 11 , wherein the first N-type semiconductor and the second P-type semiconductor are formed on the fifth electrode, and the second N-type semiconductor and the first P-type semiconductor are formed on the sixth electrode. 
     
     
       13. The method as claimed in  claim 11 , wherein the first N-type semiconductor and the first P-type semiconductor are formed on the third electrode and the fourth electrode respectively, and the second P-type semiconductor and the second N-type semiconductor are formed on the seventh electrode. 
     
     
       14. The method as claimed in  claim 11 , wherein the substrate is a second solar cell having an eighth electrode disposed on the first surface and a ninth electrode disposed on the first surface, and the eighth electrode and the ninth electrode are further electrically connected to the fifth electrode and the sixth electrode respectively when the first solar cell and the substrate are assembled.