Inventor

KO CHENG-TA

TW61 patents

⚠️ This page may combine multiple inventors who share the name “KO CHENG-TA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KO CHENG-TA

UNIMICRON TECHNOLOGY CORP

Circuit carrier and manufacturing method thereof and package structure

Chip package structure

Package structure with structure reinforcing element and manufacturing method thereof

Circuit board structure and manufacturing method thereof

Package structure and manufacturing method thereof

Vapor chamber device and manufacturing method thereof

Manufacturing method of package structure

Circuit substrate structure and manufacturing method thereof

Circuit board structure and manufacturing method thereof

Manufacturing method of carrier structure

Manufacturing method of chip package structure

Chip package structure and manufacturing method thereof

Electronic device bonding structure and fabrication method thereof

Package structure with structure reinforcing element and manufacturing method thereof

Package structure with structure reinforcing element and manufacturing method thereof

Carrier structure and manufacturing method thereof

Package substrate structure and bonding method thereof

Package structure and method for manufacturing the same

Co-packaged structure for optics and electrics

Anti-diffusion substrate structure and manufacturing method thereof

Manufacturing method of circuit board structure

Substrate structure and cutting method thereof

Flexible circuit board and manufacturing method thereof

Circuit board structure and manufacturing method thereof

Package structure and manufacturing method thereof

Mask structure and manufacturing method thereof

Package structure and manufacturing method of the same

Package structure and manufacturing method thereof

Chip package structure and manufacturing method thereof

Package structure and bonding method thereof

Stacked structure and method for manufacturing the same

Method for manufacturing circuit redistribution structure

Circuit redistribution structure unit and method for manufacturing circuit redistribution structure

Package structure and manufacturing method thereof

Chip package structure and manufacturing method thereof

Circuit board, package structure and method of manufacturing the same

Circuit board structure and manufacturing method thereof

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Circuit board structure and manufacturing method thereof

Package structure and method of manufacturing the same

IND TECH RES INST

Semiconductor device, manufacturing method and stacking structure thereof

Miniaturized particulate matter detector and manufacturing method of a filter

Integrated package structure having solar cell and thermoelectric element and method of fabricating the same

Encapsulation of backside illumination photosensitive device

Structure of embedded active components and manufacturing method thereof

KO CHENG-TA

Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof

LEE YUAN-CHANG

Flexible circuit structure

UNIV NAT CHIAO TUNG

Heterostructure containing IC and LED and method for fabricating the same

CHEN KUAN-NENG

Heterostructure containing IC and LED and method for fabricating the same