Inventor
YU CHIH-KUANG
TW38 patents
⚠️ This page may combine multiple inventors who share the name “YU CHIH-KUANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
YU CHIH-KUANG
7 patentsUS8241932B1Aug 14, 2012
Methods of fabricating light emitting diode packages
YU CHIH-KUANG49 citations97
US8604491B2Dec 10, 2013
Wafer level photonic device die structure and method of making the same
YU CHIH-KUANG7 citations83
US8598617B2Dec 3, 2013
Methods of fabricating light emitting diode packages
YU CHIH-KUANG6 citations83
US8546924B2Oct 1, 2013
Package structures for integrating thermoelectric components with stacking chips
YU CHIH-KUANG3 citations62
US8962358B2Feb 24, 2015
Double substrate multi-junction light emitting diode array structure
YU CHIH-KUANG1 citations51
US8519409B2Aug 27, 2013
Light emitting diode components integrated with thermoelectric devices
YU CHIH-KUANG0 citations51
US8222728B2Jul 17, 2012
Active solid heatsink device and fabricating method thereof
YU CHIH-KUANG0 citations51
IND TECH RES INST
7 patentsUS7633154B2Dec 15, 2009
Encapsulation and methods thereof
IND TECH RES INST53 citations97
US7586125B2Sep 8, 2009
Light emitting diode package structure and fabricating method thereof
IND TECH RES INST21 citations92
US7999172B2Aug 16, 2011
Flexible thermoelectric device
IND TECH RES INST13 citations84
US8008573B2Aug 30, 2011
Integrated package structure having solar cell and thermoelectric element and method of fabricating the same
IND TECH RES INST2 citations62
US7517114B2Apr 14, 2009
Lighting devices
IND TECH RES INST3 citations62
US7972877B2Jul 5, 2011
Fabricating method of light emitting diode package
IND TECH RES INST1 citations52
US7855396B2Dec 21, 2010
Light emitting diode package structure
IND TECH RES INST1 citations52
TSMC SOLID STATE LIGHTING LTD
7 patentsUS9349712B2May 24, 2016
Doubled substrate multi-junction light emitting diode array structure
TSMC SOLID STATE LIGHTING LTD4 citations73
US8993447B2Mar 31, 2015
LED device with improved thermal performance
TSMC SOLID STATE LIGHTING LTD2 citations63
US8722436B2May 13, 2014
Method and apparatus for accurate die-to-wafer bonding
TSMC SOLID STATE LIGHTING LTD1 citations63
US9287478B2Mar 15, 2016
Method and apparatus for accurate die-to-wafer bonding
TSMC SOLID STATE LIGHTING LTD0 citations52
US9224932B2Dec 29, 2015
Wafer level photonic device die structure and method of making the same
TSMC SOLID STATE LIGHTING LTD0 citations52
US9184334B2Nov 10, 2015
LED structure
TSMC SOLID STATE LIGHTING LTD0 citations51
US8809899B2Aug 19, 2014
LED structure
TSMC SOLID STATE LIGHTING LTD0 citations51
HSIA HSING-KUO
5 patentsUS8653542B2Feb 18, 2014
Micro-interconnects for light-emitting diodes
HSIA HSING-KUO19 citations83
US8519538B2Aug 27, 2013
Laser etch via formation
HSIA HSING-KUO7 citations80
US8912033B2Dec 16, 2014
Dicing-free LED fabrication
HSIA HSING-KUO2 citations60
US8415684B2Apr 9, 2013
LED device with improved thermal performance
HSIA HSING-KUO3 citations60
US8415183B2Apr 9, 2013
Wafer level conformal coating for LED devices
HSIA HSING-KUO0 citations51