Inventor

LIU CHUN-KAI

TW36 patents

⚠️ This page may combine multiple inventors who share the name “LIU CHUN-KAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIU CHUN-KAI

IND TECH RES INST

Encapsulation and methods thereof

Light emitting diode package structure and fabricating method thereof

Three-dimensional stacked heat spreader assembly for electronic package and method for assembling

Flexible thermoelectric device

Power module and manufacturing method thereof

Power module

Waste heat exchanger

Power module

Power module

Integrated package structure having solar cell and thermoelectric element and method of fabricating the same

Method of fabricating an entegral device of a biochip intergrated with micro thermo-electric elements and the apparatus thereof

Lighting devices

Intelligent diagnosis system for power module and method thereof

Opto-electrical module packaging

Power module housing

Power module

Fabricating method of light emitting diode package

Light emitting diode package structure

Plug-in type power module and subsystem thereof

Plug-in type power module and subsystem thereof

Passive alignment packaging structure for opto-electrical devices and optic fiber connectors

LIU CHUN-KAI

Semiconductor device

Stacked-chip packaging structure and fabrication method thereof

Micro thermoelectric device and manufacturing method thereof

Light emitting apparatus and fabrication method thereof

Thermoelectric apparatus and method of fabricating the same

Sensing device and method for operating same

DAI MING-JI

Apparatus and method for measuring characteristic and chip temperature of LED

Self-assembly apparatus, device self-assembling method, and method of assembling thermoelectric devices

YU CHIH-KUANG

Package structures for integrating thermoelectric components with stacking chips

Active solid heatsink device and fabricating method thereof

IND TECHNOLOGY RES INSTITURE

Apparatus and method for measuring diode chip

LEU MING-SHENG

Thermally conductive, electrically insulating composite film and stack chip package structure utilizing the same

ELAN MICROELECTRONICS CORP

Active pixel sensor device and operating method of the same

NAT UNIV TSING HUA

Optical recognition system and method thereof

FENG SUH-YUN

Thermoelectric conversion device