Inventor
DAI MING-JI
TW30 patents
⚠️ This page may combine multiple inventors who share the name “DAI MING-JI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
14 patentsUS7633154B2Dec 15, 2009
Encapsulation and methods thereof
IND TECH RES INST53 citations97
US7586125B2Sep 8, 2009
Light emitting diode package structure and fabricating method thereof
IND TECH RES INST21 citations92
US7999172B2Aug 16, 2011
Flexible thermoelectric device
IND TECH RES INST13 citations84
US8008573B2Aug 30, 2011
Integrated package structure having solar cell and thermoelectric element and method of fabricating the same
IND TECH RES INST2 citations62
US7517114B2Apr 14, 2009
Lighting devices
IND TECH RES INST3 citations62
US10343868B2Jul 9, 2019
Roller with pressure sensor and R to R device
IND TECH RES INST1 citations61
US10288696B2May 14, 2019
Intelligent diagnosis system for power module and method thereof
IND TECH RES INST1 citations61
US9130080B2Sep 8, 2015
Encapsulation of backside illumination photosensitive device
IND TECH RES INST3 citations61
US9448121B2Sep 20, 2016
Measurement method, measurement apparatus, and computer program product
IND TECH RES INST2 citations60
US7972877B2Jul 5, 2011
Fabricating method of light emitting diode package
IND TECH RES INST1 citations52
US7855396B2Dec 21, 2010
Light emitting diode package structure
IND TECH RES INST1 citations52
US11243520B2Feb 8, 2022
Human-machine interface system and communication control device thereof
IND TECH RES INST0 citations51
US11132786B2Sep 28, 2021
Board defect filtering method based on defect list and circuit layout image and device thereof and computer-readable recording medium
IND TECH RES INST0 citations45
US10540474B2Jan 21, 2020
Chip temperature computation method and chip temperature computation device
IND TECH RES INST0 citations41
TAIN RA-MIN
6 patentsUS8552554B2Oct 8, 2013
Heat dissipation structure for electronic device and fabrication method thereof
TAIN RA-MIN9 citations83
US8502224B2Aug 6, 2013
Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensor
TAIN RA-MIN2 citations62
US8278755B2Oct 2, 2012
Heat dissipation structure for electronic device and fabrication method thereof
TAIN RA-MIN3 citations61
US8536701B2Sep 17, 2013
Electronic device packaging structure
TAIN RA-MIN1 citations51
US8507909B2Aug 13, 2013
Measuring apparatus that includes a chip with a through silicon via, a heater having plural switches, and a stress sensor
TAIN RA-MIN0 citations51
US8288655B2Oct 16, 2012
Circuit board structure and manufacturing method thereof
TAIN RA-MIN0 citations51
LIU CHUN-KAI
4 patentsUS8674491B2Mar 18, 2014
Semiconductor device
LIU CHUN-KAI7 citations83
US8193625B2Jun 5, 2012
Stacked-chip packaging structure and fabrication method thereof
LIU CHUN-KAI9 citations83
US8310037B2Nov 13, 2012
Light emitting apparatus and fabrication method thereof
LIU CHUN-KAI2 citations62
US8664509B2Mar 4, 2014
Thermoelectric apparatus and method of fabricating the same
LIU CHUN-KAI2 citations59
DAI MING-JI
3 patentsUS8075182B2Dec 13, 2011
Apparatus and method for measuring characteristic and chip temperature of LED
DAI MING-JI64 citations95
US8609454B2Dec 17, 2013
Self-assembly apparatus, device self-assembling method, and method of assembling thermoelectric devices
DAI MING-JI20 citations86
US8456017B2Jun 4, 2013
Filled through-silicon via with conductive composite material
DAI MING-JI10 citations80