Inventor
OSTRANDER STEVE
US14 patents
⚠️ This page may combine multiple inventors who share the name “OSTRANDER STEVE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
12 patentsUS10833051B2Nov 10, 2020
Precision alignment of multi-chip high density interconnects
IBM2 citations72
US10580738B2Mar 3, 2020
Direct bonded heterogeneous integration packaging structures
IBM4 citations71
US10916507B2Feb 9, 2021
Multiple chip carrier for bridge assembly
IBM0 citations62
US11569181B2Jan 31, 2023
Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers
IBM0 citations61
US11404287B2Aug 2, 2022
Fixture facilitating heat sink fabrication
IBM0 citations61
US11177217B2Nov 16, 2021
Direct bonded heterogeneous integration packaging structures
IBM0 citations61
US10978313B2Apr 13, 2021
Fixture facilitating heat sink fabrication
IBM0 citations61
US10892233B2Jan 12, 2021
Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers
IBM0 citations61
US11521952B2Dec 6, 2022
Spacer for die-to-die communication in an integrated circuit and method for fabricating the same
IBM0 citations59
US11031373B2Jun 8, 2021
Spacer for die-to-die communication in an integrated circuit
IBM1 citations59
US11152226B2Oct 19, 2021
Structure with controlled capillary coverage
IBM0 citations53
US10985129B2Apr 20, 2021
Mitigating cracking within integrated circuit (IC) device carrier
IBM0 citations51