Inventor
PARK JAE M
US31 patents
⚠️ This page may combine multiple inventors who share the name “PARK JAE M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
15 patentsUS5300208AApr 5, 1994
Fabrication of printed circuit boards using conducting polymer
IBM108 citations96
US5280414AJan 18, 1994
Au-Sn transient liquid bonding in high performance laminates
IBM52 citations96
US5283104AFeb 1, 1994
Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates
IBM80 citations94
US4969979ANov 13, 1990
Direct electroplating of through holes
IBM66 citations94
US5421507AJun 6, 1995
Au-Sn transient liquid bonding in high performance laminates
IBM27 citations92
US5173392ADec 22, 1992
Forming a pattern on a substrate
IBM27 citations92
US5122439AJun 16, 1992
Forming a pattern on a substrate
IBM30 citations92
US5055342AOct 8, 1991
Fluorinated polymeric composition, fabrication thereof and use thereof
IBM69 citations92
US4781970ANov 1, 1988
Strengthening a ceramic by post sinter coating with a compressive surface layer
IBM28 citations92
US5340451AAug 23, 1994
Process for producing a metal organic polymer combination
IBM22 citations91
US5337475AAug 16, 1994
Process for producing ceramic circuit structures having conductive vias
IBM37 citations91
US4869930ASep 26, 1989
Method for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless metallization
IBM36 citations90
US4868253ASep 19, 1989
β-diketone-polymer reaction product
IBM7 citations70
US5507872AApr 16, 1996
Contact sensor-based microdispensing tool
IBM12 citations65
US5006412AApr 9, 1991
Substrate of metal-complexed beta-diketone/thermosetting polymer reaction product
IBM2 citations59
TESSERA INC
10 patentsUS7495179B2Feb 24, 2009
Components with posts and pads
TESSERA INC70 citations98
US7176506B2Feb 13, 2007
High frequency chip packages with connecting elements
TESSERA INC320 citations98
US7053485B2May 30, 2006
Microelectronic packages with self-aligning features
TESSERA INC76 citations98
US7659617B2Feb 9, 2010
Substrate for a flexible microelectronic assembly and a method of fabricating thereof
TESSERA INC49 citations94
US7397068B2Jul 8, 2008
Solid state lighting device
TESSERA INC37 citations93
US7368695B2May 6, 2008
Image sensor package and fabrication method
TESSERA INC50 citations89
US8046912B2Nov 1, 2011
Method of making a connection component with posts and pads
TESSERA INC5 citations74
US7304376B2Dec 4, 2007
Microelectronic assemblies with springs
TESSERA INC4 citations63
US7763983B2Jul 27, 2010
Stackable microelectronic device carriers, stacked device carriers and methods of making the same
TESSERA INC2 citations62
US7268304B2Sep 11, 2007
Microelectronic connection components having bondable wires
TESSERA INC3 citations59