Inventor

LIN YUSHENG

US83 patents

⚠️ This page may combine multiple inventors who share the name “LIN YUSHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN YUSHENG

SEMICONDUCTOR COMPONENTS IND LLC

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Low stress asymmetric dual side module

High power module package structures

Semiconductor package with elastic coupler and related methods

Semiconductor package with elastic coupler and related methods

Semiconductor backmetal (BM) and over pad metallization (OPM) structures and related methods

Press-fit pin for semiconductor packages and related methods

Embedded stacked die packages and related methods

High power module package structures

Thinned semiconductor package and related methods

Press-fit pin for semiconductor packages and related methods

Semiconductor package with elastic coupler and related methods

Semiconductor copper metallization structure and related methods

Semiconductor copper metallization structure and related methods

Semiconductor package with elastic coupler and related methods

Semiconductor device assemblies including spacer with embedded semiconductor die

Embedded stacked die packages and related methods

Reinforced semiconductor die and related methods

Image sensor semiconductor packages and related methods

Semiconductor device and method of integrating power module with interposer and opposing substrates

Semiconductor package electrical contact structures and related methods

Multi-chip system-in-package

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Fan-out wafer level packaging of semiconductor devices

Multiple substrate package systems and related methods

Thinned semiconductor package and related methods

Monolithic semiconductor device assemblies

Monolithic semiconductor device assemblies

Semiconductor package with elastic coupler and related methods

Press-fit pin for semiconductor packages and related methods

Isolation in a semiconductor device

Fan-out wafer level packaging of semiconductor devices

Semiconductor package electrical contacts and related methods

Substrate structures and methods of manufacture

Die sidewall coatings and related methods

High power module package structures

Semiconductor package stress balance structures and related methods

Semiconductor packages and related methods

Die sidewall coatings and related methods

Power device module with dummy pad die layout

Assembly processes for semiconductor device assemblies including spacer with embedded semiconductor die

Spacer with pattern layout for dual side cooling power module

SEMICONDUCTOR COMPONENTS IND

Substrate structures and methods of manufacture